SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20230307256A1

    公开(公告)日:2023-09-28

    申请号:US18180405

    申请日:2023-03-08

    CPC classification number: H01L21/67023 B08B3/022

    Abstract: This invention includes a substrate holder provided rotatably about an axis of rotation extending in a vertical direction while sucking and holding a central part of a lower surface of a substrate, a rotating mechanism for outputting a rotational driving force for rotating the substrate holder, a processing mechanism for processing the substrate by supplying a processing liquid to the substrate held by the substrate holder, and a rotating cup provided rotatably about the axis of rotation while surrounding an outer periphery of the rotating substrate and configured to collect liquid droplets of the processing liquid scattered from the substrate. The rotating mechanism includes a power transmitter for transmitting a part of the rotational driving force as a cup driving force to the rotating cup, and simultaneously rotates the substrate holder and the rotating cup by the rotational driving force.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20240363375A1

    公开(公告)日:2024-10-31

    申请号:US18642941

    申请日:2024-04-23

    CPC classification number: H01L21/6708 G05B19/4099 G05B2219/45031

    Abstract: In this invention, a substrate with a notch on its periphery is rotated and a processing fluid is discharged from a nozzle while the nozzle is moved outward from an outside of the substrate through an edge surface of the substrate to the maximum processing position, which is a predetermined bevel processing distance away from the edge surface, and then the nozzle is returned in the opposite direction of the outward movement. Operating conditions including a rotation of the substrate, a discharge of the processing liquid, and the movement of the nozzle are not fixed but are switched at an intermediate position between the end surface and the maximum processing position.

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明公开

    公开(公告)号:US20240071793A1

    公开(公告)日:2024-02-29

    申请号:US18366034

    申请日:2023-08-07

    CPC classification number: H01L21/67253 H01L21/6708 H01L21/67109

    Abstract: In a substrate processing apparatus according to the present invention, a heating mechanism for heating a substrate includes a gas discharge nozzle arranged in an internal space, a heater attached to an outer wall of a chamber, and a pipe feeding to the discharge nozzle. An observing mechanism includes a light source part and an image pickup part which are arranged at a separation position away from an attachment portion in the outer wall of the chamber. Thus, the light source part and the image pickup part become less susceptible to an effect of heat generated by the heater. In other words, it is possible to prevent the reduction in the observation accuracy due to an effect of temperature change.

    SUBSTRATE PROCESSING APPARATUS
    5.
    发明申请

    公开(公告)号:US20240404846A1

    公开(公告)日:2024-12-05

    申请号:US18674813

    申请日:2024-05-24

    Inventor: Shuhei NEMOTO

    Abstract: In a substrate processing apparatus, a rotating mechanism holds a circular substrate in a horizontal posture and rotates the substrate about a vertical axis passing through a center of the substrate. A nozzle mechanism includes a nozzle body, a support and a position adjuster. The nozzle body is arranged below the substrate and having a discharge port from which a processing liquid is discharged toward a lower surface peripheral edge part of the substrate. The support supports the nozzle body in a manner that makes the position of the discharge port changeable in a radial direction of the substrate. The position adjuster adjusts the position of the discharge port by moving the nozzle body relative to the support. Thee support and the position adjuster are arranged internal to a virtual arc centered on the vertical axis and passing through the discharge port.

    Centering Device, Centering Method and Substrate Processing Apparatus

    公开(公告)号:US20240258148A1

    公开(公告)日:2024-08-01

    申请号:US18419384

    申请日:2024-01-22

    CPC classification number: H01L21/68 H01L21/6708

    Abstract: This invention relates to a centering device, a centering method and a substrate processing apparatus. substrate supported on a substrate support is surrounded by a first contact member located at a first reference position, a second contact member located at a second reference position and a third contact member located at a third reference position in the horizontal plane. These three contact members gradually approach the substrate while keeping distances from a center of the substrate support equal by repeating the minute movements. Considering that the minute movement directions of the second and third contact members are different from each other, first and second angles are each set in a range of 40° or larger and 60° or smaller.

    CENTERING DEVICE, CENTERING METHOD AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20240258144A1

    公开(公告)日:2024-08-01

    申请号:US18416416

    申请日:2024-01-18

    Abstract: A substrate supported on a substrate support is surrounded by a first contact member located at a first reference position, a second contact member located at a second reference position and a third contact member located at a third reference position in the horizontal plane. These three contact members gradually approach the substrate while keeping distances from a center of the substrate support equal by repeating the minute movements. The substrate posture is so adjusted that the direction of eccentricity is parallel to the virtual line prior to the start of the movements of the contact members. In the invention, the substrate posture is so adjusted that the direction of eccentricity is parallel to the virtual line prior to the above centering of the substrate.

    SUBSTRATE PROCESSING APPARATUS
    8.
    发明公开

    公开(公告)号:US20230307257A1

    公开(公告)日:2023-09-28

    申请号:US18181295

    申请日:2023-03-09

    CPC classification number: H01L21/67023 H01L21/68714

    Abstract: In the invention, a rotating cup includes a lower cup to be rotated about the axis of rotation by receiving a cup driving force applied from a rotating mechanism and an upper cup for collecting the liquid droplets scattered through the collection space while rotating about the axis of rotation integrally with the lower cup by being coupled to the lower cup. The upper cup includes a first coupling part allowing communication between the collection space and a discharge space by being located above the lower cup and forming a gap between the lower cup and the first coupling part, and an inclined part provided obliquely upward of a peripheral edge part of the substrate from the first coupling part and configured to collect the liquid droplets by an inclined surface facing the collection space.

    SUBSTRATE PROCESSING APPARATUS
    10.
    发明公开

    公开(公告)号:US20240066684A1

    公开(公告)日:2024-02-29

    申请号:US18366027

    申请日:2023-08-07

    Inventor: Shuhei NEMOTO

    CPC classification number: B25J9/042 B25J11/0095

    Abstract: In an substrate processing apparatus according to the present invention, a chamber has a a conveyance opening for conveying the substrate along a conveyance path between the outside of the chamber and the substrate holder and a maintenance opening provided on an opposite side of the conveyance opening with the substrate holder. A rotating mechanism has a motor for generating a rotational driving force to rotate the substrate holder and a power transmitter for transmitting the rotational driving force generated by the motor to the substrate holder. The motor and the power transmitter are so arranged on the opposite side of the conveyance opening with respect to the substrate holder, as to face the maintenance opening, to thereby make the rotating mechanism accessible through the maintenance opening from the outside.

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