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公开(公告)号：US20240390953A1
公开(公告)日：2024-11-28
申请号：US18694385
申请日：2022-07-25
Applicant: SCREEN HOLDINGS CO., LTD.
Inventor： Takuma TAKAHASHI , Ryo MURAMOTO , Kazuki NAKAMURA , Kazuki CHIBA
Abstract: A substrate processing apparatus includes a substrate holder that holds an outer peripheral end of a substrate, a processor that processes a front surface or a back surface of the substrate, and a holding controller that controls the substrate holder such that a center portion of the substrate is displaced in an upward direction or a downward direction in a period during which the substrate is processed by the processor.
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公开(公告)号：US20230307256A1
公开(公告)日：2023-09-28
申请号：US18180405
申请日：2023-03-08
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Shuhei NEMOTO , Kazuhiro SHOJI , Ryo MURAMOTO
CPC classification number: H01L21/67023 , B08B3/022
Abstract: This invention includes a substrate holder provided rotatably about an axis of rotation extending in a vertical direction while sucking and holding a central part of a lower surface of a substrate, a rotating mechanism for outputting a rotational driving force for rotating the substrate holder, a processing mechanism for processing the substrate by supplying a processing liquid to the substrate held by the substrate holder, and a rotating cup provided rotatably about the axis of rotation while surrounding an outer periphery of the rotating substrate and configured to collect liquid droplets of the processing liquid scattered from the substrate. The rotating mechanism includes a power transmitter for transmitting a part of the rotational driving force as a cup driving force to the rotating cup, and simultaneously rotates the substrate holder and the rotating cup by the rotational driving force.
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公开(公告)号：US20230094318A1
公开(公告)日：2023-03-30
申请号：US17880907
申请日：2022-08-04
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Yosuke YASUTAKE , Ryo MURAMOTO
IPC: H01L21/67 , H01L21/687 , H01L21/673
Abstract: In a substrate processing apparatus for supplying a processing liquid onto a lower surface of a substrate being rotated, to thereby process the substrate, provided are an upper support body which is separably placed on a lower support body, a plurality of upper holding members protruding downward from the upper support body, for holding the substrate, and an upper hold-driving part for moving the upper holding members separably from and contactably with an outer edge portion of the substrate. Preferably, the upper hold-driving part moves the upper holding members by using a magnetic action between holding-side magnetic members and an annular driving-side magnetic member.
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公开(公告)号：US20240261814A1
公开(公告)日：2024-08-08
申请号：US18638692
申请日：2024-04-18
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Hiroshi ABE , Takashi OTA , Takaaki ISHIZU , Kenji KOBAYASHI , Ryo MURAMOTO , Sei NEGORO , Manabu OKUTANI , Wataru SAKAI
CPC classification number: B05C11/08 , B05B1/24 , G03F7/40 , H01L21/0262 , H01L21/02628 , H01L21/02057 , H01L21/67017 , H01L21/67034 , H01L21/67051 , H01L21/67098 , H01L21/67103 , H01L21/67115 , H01L21/6715 , H01L21/68764 , H01L21/68785 , H05B3/0047
Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film, a liquid film heat retaining step of keeping the liquid film warm, a gas phase layer forming step of forming a gas phase layer which holds the processing liquid on a center portion of the liquid film, an opening forming step of forming an opening in the center portion of the liquid film by excluding the processing liquid held by the gas phase layer, a substrate rotating step of rotating the substrate around a rotation axis, and an opening expanding step of expanding the opening, while a state in which the gas phase layer is formed on an inner circumferential edge of the liquid film is maintained, by moving the irradiation region toward a circumferential edge portion of the substrate while the liquid film heat retaining step and the substrate rotating step are performed.
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公开(公告)号：US20210197224A1
公开(公告)日：2021-07-01
申请号：US17133647
申请日：2020-12-24
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Hiroshi ABE , Takashi OTA , Takaaki ISHIZU , Kenji KOBAYASHI , Ryo MURAMOTO , Sei NEGORO , Manabu OKUTANI , Wataru SAKAI
Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film, a liquid film heat retaining step of keeping the liquid film warm, a gas phase layer forming step of forming a gas phase layer which holds the processing liquid on a center portion of the liquid film, an opening forming step of forming an opening in the center portion of the liquid film by excluding the processing liquid held by the gas phase layer, a substrate rotating step of rotating the substrate around a rotation axis, and an opening expanding step of expanding the opening, while a state in which the gas phase layer is formed on an inner circumferential edge of the liquid film is maintained, by moving the irradiation region toward a circumferential edge portion of the substrate while the liquid film heat retaining step and the substrate rotating step are performed.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180277417A1
公开(公告)日：2018-09-27
申请号：US15901960
申请日：2018-02-22
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Hiroaki ISHII , Ryo MURAMOTO
IPC: H01L21/687 , H01L21/67 , H01L21/306
CPC classification number: H01L21/68764 , H01L21/30604 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/68728 , H01L21/68742 , H01L21/68785
Abstract: The substrate holding/rotating device includes a plurality of movable pins each having a support portion in contact with a peripheral edge portion of the substrate to support the substrate, and a rotation unit which rotates the plurality of movable pins around the rotation axis, a support portion of each of the movable pins included in a first pin group is disposed so as to move between a first hold position included hold positions, the first hold position close to a rotation axis and a second hold position included the hold positions, the second hold position far apart from the first hold position to one in a circumferential direction and also so as to move between the first and second hold positions and an open position far apart from the rotation axis.
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公开(公告)号：US20160236241A1
公开(公告)日：2016-08-18
申请号：US15136214
申请日：2016-04-22
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Sei NEGORO , Ryo MURAMOTO , Yasuhiko NAGAI , Tsutomu OSUKA , Keiji IWATA
CPC classification number: B08B3/08 , B08B3/02 , B08B3/10 , C11D3/0052 , C11D11/0047 , C11D11/0064 , C11D11/007 , H01L21/67028 , H01L21/67051
Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.
Abstract translation: 基板处理方法包括：向基板的上表面供给具有高温的SPM的SPM供给工序; DIW供给工序，在SPM供给工序后，将具有室温的DIW供给到所述基板的上表面，进行冲洗 剩余在基板上的液体，以及过氧化氢水供给步骤，在SPM供给工序后和DIW供给工序之前，供给液温低于SPM的温度以上且不低于室温的过氧化氢水， 在SPM保持在基板上的状态下到基板的上表面。
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公开(公告)号：US20230096580A1
公开(公告)日：2023-03-30
申请号：US17880827
申请日：2022-08-04
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Yosuke YASUTAKE , Ryo MURAMOTO
IPC: H01L21/687 , H01L21/67
Abstract: In a substrate processing apparatus for supplying a processing liquid onto a substrate being rotated, to thereby process the substrate, an upper support body which is a placement member is separably placed on a lower support body for supporting the substrate. The upper support body is moved up and down by an up-and-down moving part. The upper support body includes a first contact part outside an outer periphery of the substrate in a radial direction. When a second contact part of the up-and-down moving part goes up, the second contact part comes into contact with the first contact part, to thereby move the upper support body up. When the second contact part goes down, the upper support body is placed on the lower support body and the second contact part is separated from the first contact part, and in this state, the lower support body is rotatable.
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公开(公告)号：US20210175098A1
公开(公告)日：2021-06-10
申请号：US16071104
申请日：2016-12-26
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Michinori IWAO , Ryo MURAMOTO
IPC: H01L21/67 , H01L21/311 , H01L21/02
Abstract: A substrate rotation mechanism rotates the substrate holder about a central axis. A top plate opposes the upper surface of the substrate and rotates about the central axis. A gas supply part supplies a treatment atmospheric gas to a radial central part of a lower space that is a space below the top plate. An ion generator generates and supplies ions to the treatment atmospheric gas supplied from the gas supply part. Then, in a state in which the top plate is positioned lower than when the substrate is transported into the apparatus, the treatment atmospheric gas that contains the ions is supplied to the lower space to form an ion stream that spreads radially outward from the radial central part of the lower space while rotating the substrate holder and the top plate. Accordingly, charges can be dissipated from the top plate with a simple structure.
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公开(公告)号：US20210134652A1
公开(公告)日：2021-05-06
申请号：US16639413
申请日：2018-08-01
Applicant: SCREEN Holdings Co., Ltd.
Inventor： Ryo MURAMOTO
IPC: H01L21/687 , H01L21/67
Abstract: A substrate holding apparatus is used for a substrate processing apparatus for supplying the processing liquid to a substrate. The substrate holding apparatus includes a holding member, a ring member, and a rotation mechanism. The holding member holds the substrate in a horizontal attitude. The ring member is in a shape of a ring surrounding a peripheral edge of the substrate held by the holding member, and has an upper surface level with or positioned below a front surface of the substrate. The rotation mechanism rotates the holding member and the ring member about a rotation axis at rotation speeds different from each other and/or in rotational directions different from each other, the rotation axis being a vertical axis passing through the substrate held by the holding member.
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