Abstract:
Provided is a semiconductor resistor circuit with high accuracy. An insulating film is formed to cover a plurality of resistor groups having upper portions covered with a plurality of metal wirings. The insulating film has a membrane stress that is higher than that of the metal wirings, and is formed between the metal wirings and the resistor groups.
Abstract:
Provided is a constant voltage circuit having a stable output voltage. In a constant voltage circuit formed by connecting an enhancement type NMOS and a depression type NMOS in series, in order to enhance the back bias effect of the depression type NMOS, the impurity concentration is set to be high only in a P-type well region on which the depression type NMOS is arranged.
Abstract:
Provided is a semiconductor integrated circuit device having flexible pin arrangement. A semiconductor integrated circuit is bonded to a die pad with an insulating paste, and the potential of the die pad is fixed through a bonding wire from an Al pad provided on the surface of the semiconductor integrated circuit. In the case of a P-type semiconductor substrate, the die pad is set as a terminal other than a terminal having a minimum operating potential of the semiconductor integrated circuit.
Abstract:
Provided is a semiconductor integrated circuit device including a memory element to which a voltage and a current is input via a regulating input terminal to be able to change a threshold voltage thereof. The semiconductor integrated circuit device can change an output voltage depending on the threshold voltage. Also provided is a method of regulating an output voltage of the semiconductor integrated circuit device, including changing an input voltage to the regulating input terminal to change the output voltage, thereby setting an arbitrary output voltage.
Abstract:
A semiconductor device includes a resistance circuit and an insulated gate field effect transistor. The resistance circuit includes a resistance element having a first thin film arranged on an isolation oxide film provided on a surface of a semiconductor substrate, a second thin film of silicon nitride formed on the first thin film so as to be wider than the resistance element, an intermediate insulating film formed on the second thin film, a contact hole passing through the second thin film and being provided in the intermediate insulating film at a depth reaching the first thin film, and a metal wiring formed in the contact hole. The insulated gate field effect transistor is provided in a region of the semiconductor substrate surrounded by the isolation oxide film.
Abstract:
An ESD protection circuit having a smaller area is provided. The ESD protection circuit includes: a P-type diffusion resistor 12 whose one end is connected to an input terminal 11 formed in the N-type well; a diode 14 disposed between the diffusion resistor 12 and the N-type well connected to the power supply terminal; an NMOS transistor 15 whose drain is connected to the other end of the diffusion resistor 12; and a parasitic diode formed between the power supply terminal and the ground terminal.
Abstract:
A semiconductor device has a resistance circuit including a resistance element as a first thin film arranged on an isolation oxide film provided on a surface of a semiconductor substrate, a second thin film comprised of silicon nitride formed on the first thin film, an intermediate insulating film formed on the second thin film, a contact hole passing through the second thin film, and a metal wiring formed on the contract hole. The first thin film has a low concentration impurity region and a high concentration impurity region at each of both ends of the low concentration impurity region. The second thin film is formed on the first thin film so as to be disposed on each of the high concentration impurity regions but not on the low concentration impurity region. An insulated gate field effect transistor is provided in a region of the semiconductor substrate surrounded by the isolation oxide film.