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公开(公告)号：US09382445B2
公开(公告)日：2016-07-05
申请号：US14425367
申请日：2013-09-03
IPC分类号： H01B3/40 , C09D163/00 , H05K1/03 , H05K3/46 , C08K9/06
CPC分类号： C09D163/00 , C08G59/423 , C08G59/686 , C08G2650/56 , C08K3/36 , C08K5/5419 , C08K9/06 , C08K2201/014 , C08L63/00 , H01B3/40 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2201/0239
摘要： Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer.The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.
摘要翻译： 提供了能够降低固化物体的表面的表面粗糙度的绝缘性树脂材料，并且当在固化物体的表面上形成金属层时，增加了固化物和金属层之间的粘合强度。 本发明的绝缘树脂材料包括热固性树脂，固化剂，用第一硅烷偶联剂表面处理的第一无机填料和用第二硅烷偶联剂表面处理的第二无机填料。 当含量最多的热固性树脂和第一硅烷偶联剂的有机基团的SP值之间的绝对差定义为SP（A）时，当绝热含量最高的热固性树脂的SP值与有机物 第二硅烷偶联剂组被定义为SP（B）; （SP（A）-SP（B））不小于0.5但不大于3.5。
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公开(公告)号：US20150210884A1
公开(公告)日：2015-07-30
申请号：US14425367
申请日：2013-09-03
IPC分类号： C09D163/00 , C08K9/06 , H05K1/03
CPC分类号： C09D163/00 , C08G59/423 , C08G59/686 , C08G2650/56 , C08K3/36 , C08K5/5419 , C08K9/06 , C08K2201/014 , C08L63/00 , H01B3/40 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2201/0239
摘要： Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer.The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.
摘要翻译： 提供了能够降低固化物体的表面的表面粗糙度的绝缘性树脂材料，并且当在固化物体的表面上形成金属层时，增加了固化物和金属层之间的粘合强度。 本发明的绝缘树脂材料包括热固性树脂，固化剂，用第一硅烷偶联剂表面处理的第一无机填料和用第二硅烷偶联剂表面处理的第二无机填料。 当含量最多的热固性树脂和第一硅烷偶联剂的有机基团的SP值之间的绝对差定义为SP（A）时，当绝热含量最高的热固性树脂的SP值与有机物 第二硅烷偶联剂组被定义为SP（B）; （SP（A）-SP（B））不小于0.5但不大于3.5。
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