公开(公告)号：US20210130536A1

公开(公告)日：2021-05-06

申请号：US16492378

申请日：2018-01-26

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Kohei TAKEDA ,  Sayaka WAKIOKA ,  Yuta OATARI ,  Takashi SHINJO ,  Masami SHINDO

IPC: C08G59/40 ,  C08G73/10

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

公开(公告)号：US20210130614A1

公开(公告)日：2021-05-06

申请号：US16492361

申请日：2018-01-26

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Kohei TAKEDA ,  Yuta OATARI ,  Takashi SHINJO ,  Masami SHINDO

IPC: C08L79/08 ,  C09J7/38 ,  C09J163/00 ,  C09J179/08 ,  B32B15/088 ,  B32B7/12 ,  B32B15/09 ,  B32B15/092 ,  B32B15/20

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.

公开(公告)号：US20210009749A1

公开(公告)日：2021-01-14

申请号：US16979747

申请日：2019-03-15

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Yuta OATARI ,  Kohei TAKEDA ,  Masami SHINDO ,  Takashi SHINJO ,  Yuko KAWAHARA ,  Susumu BABA ,  Tatsushi HAYASHI

IPC: C08G59/40 ,  C08K3/36 ,  C08G73/10 ,  C08G59/24 ,  C09J179/08 ,  C09J163/00 ,  C08K5/3445 ,  H05K1/03 ,  H05K3/46 ,  C09J7/35

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

公开(公告)号：US20170183548A1

公开(公告)日：2017-06-29

申请号：US15304950

申请日：2015-03-25

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Mai NAGATA ,  Kohei TAKEDA ,  Toshio ENAMI

IPC: C09J163/00 ,  H01L23/00 ,  C09J133/00 ,  C01B33/18 ,  C09J7/02 ,  H01L25/065 ,  C09C1/30

CPC classification number: C09J163/00 ,  C01B33/18 ,  C01P2004/32 ,  C01P2004/62 ,  C01P2004/64 ,  C08G59/42 ,  C08G59/5073 ,  C08K3/013 ,  C08K3/36 ,  C08K2201/014 ,  C08L33/06 ,  C09C1/30 ,  C09J7/10 ,  C09J133/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/20 ,  H01L21/52 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16146 ,  H01L2224/271 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/05442

Abstract: The present invention aims to provide an adhesive film for a semiconductor chip with a through electrode, which is used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, which can favorably connect the through electrodes while suppressing formation of voids, and which can reduce the length of burrs protruding around the semiconductor chips.The present invention relates to an adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140° C. of 8 or lower.