公开(公告)号：US20210130536A1

公开(公告)日：2021-05-06

申请号：US16492378

申请日：2018-01-26

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Kohei TAKEDA ,  Sayaka WAKIOKA ,  Yuta OATARI ,  Takashi SHINJO ,  Masami SHINDO

IPC: C08G59/40 ,  C08G73/10

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

公开(公告)号：US20160056120A1

公开(公告)日：2016-02-25

申请号：US14933145

申请日：2015-11-05

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Hiroaki NAKAGAWA ,  Yoshio NISHIMURA ,  Shujiro SADANAGA

IPC: H01L23/00 ,  C08K9/06 ,  C09J163/00

CPC classification number: H01L24/29 ,  C08K9/06 ,  C09J163/00 ,  H01L21/563 ,  H01L21/76841 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83091 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/20106 ,  H01L2924/3512 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/05442 ,  H01L2924/00012

Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ΔE of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C., and a reaction rate of 40% or less at 4 seconds at 260° C., as determined by differential scanning calorimetry and Ozawa method.

公开(公告)号：US20210130614A1

公开(公告)日：2021-05-06

申请号：US16492361

申请日：2018-01-26

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Kohei TAKEDA ,  Yuta OATARI ,  Takashi SHINJO ,  Masami SHINDO

IPC: C08L79/08 ,  C09J7/38 ,  C09J163/00 ,  C09J179/08 ,  B32B15/088 ,  B32B7/12 ,  B32B15/09 ,  B32B15/092 ,  B32B15/20

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.

公开(公告)号：US20210009749A1

公开(公告)日：2021-01-14

申请号：US16979747

申请日：2019-03-15

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Yuta OATARI ,  Kohei TAKEDA ,  Masami SHINDO ,  Takashi SHINJO ,  Yuko KAWAHARA ,  Susumu BABA ,  Tatsushi HAYASHI

IPC: C08G59/40 ,  C08K3/36 ,  C08G73/10 ,  C08G59/24 ,  C09J179/08 ,  C09J163/00 ,  C08K5/3445 ,  H05K1/03 ,  H05K3/46 ,  C09J7/35

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

公开(公告)号：US20160272854A1

公开(公告)日：2016-09-22

申请号：US15035336

申请日：2015-02-27

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA

IPC: C09J133/06 ,  H01L23/00 ,  C09J163/10 ,  C09J133/14 ,  C09J133/08

CPC classification number: C09J133/066 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  C09J133/04 ,  C09J133/08 ,  C09J133/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2433/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2969 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32501 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/94 ,  C08F220/06 ,  C08F2220/1825 ,  C08F220/20 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2224/27

Abstract: The present invention aims to provide an adhesive for mounting an electronic component. The adhesive enables sufficient soldering while preventing solder flow in a short mounting time, suppresses voids, and is excellent in reflowing resistance. The present invention also aims to provide an adhesive film for mounting a flip chip including the adhesive for mounting an electronic component. The present invention relates to an adhesive for mounting an electronic component including: an acrylic polymer having a (meth)acryloyl group in a side chain and having a double bond equivalent of 1 to 5 meq/g; a tri- or higher functional (meth)acrylate compound; and a radical polymerization initiator.

Abstract translation: 本发明的目的在于提供一种用于安装电子部件的粘合剂。 粘合剂能够在短的安装时间内防止焊料流动，从而能够进行充分的焊接，抑制空隙，并且耐回流性优异。 本发明还旨在提供一种用于安装包括用于安装电子部件的粘合剂的倒装芯片的粘合膜。 本发明涉及一种用于安装电子部件的粘合剂，其包括：侧链中具有（甲基）丙烯酰基并具有1〜5meq / g的双键当量的丙烯酸类聚合物; 三（或更高级）官能（甲基）丙烯酸酯化合物; 和自由基聚合引发剂。