公开(公告)号：US20240166790A1

公开(公告)日：2024-05-23

申请号：US18283094

申请日：2022-03-18

Applicant: SEKISUI KASEI CO., LTD.

Inventor： Hiroki OWAKI

IPC: C08F255/04 ,  C08F2/10 ,  C08F2/44 ,  C08J9/20 ,  C08K3/28 ,  C08K3/36

CPC classification number: C08F255/04 ,  C08F2/10 ,  C08F2/44 ,  C08J9/20 ,  C08K3/28 ,  C08K3/36 ,  C08J2201/024 ,  C08J2201/036

Abstract: The present invention provides a foam molded body having excellent heat resistance (low heating dimensional change rate), excellent flame retardancy, and excellent storage stability, composite resin particles for producing the foam molded body, and the like. The present invention relates to composite resin particles comprising a polypropylene-based resin, an ethylene-vinyl acetate copolymer, and a polystyrene-based resin, foam particles of the composite resin particles, and a foam molded body of the foam particles.