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公开(公告)号：US20240416394A1
公开(公告)日：2024-12-19
申请号：US18799283
申请日：2024-08-09
Applicant: SEMES CO., LTD.
Inventor： Tae-Keun KIM , Kyeong Min LEE , Min Hee CHO , Won Young KANG
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.
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公开(公告)号：US20230215740A1
公开(公告)日：2023-07-06
申请号：US17843919
申请日：2022-06-17
Applicant: SEMES CO., LTD.
Inventor： Won Young KANG , Tae Keun KIM , Kang Sul KIM , Kyeong Min LEE , Min Hee CHO
IPC: H01L21/67 , B08B3/10 , H01L21/687 , H01L21/02
CPC classification number: H01L21/67051 , B08B3/10 , H01L21/68764 , H01L21/02057
Abstract: There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.
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公开(公告)号：US20230364656A1
公开(公告)日：2023-11-16
申请号：US17740772
申请日：2022-05-10
Applicant: SEMES CO., LTD.
Inventor： Tae-Keun KIM , Kyeong Min LEE , Min Hee CHO , Won Young KANG
CPC classification number: B08B7/0014 , H01L21/02057
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.
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公开(公告)号：US20230207338A1
公开(公告)日：2023-06-29
申请号：US17978328
申请日：2022-11-01
Applicant: SEMES CO., LTD.
Inventor： Min Hee CHO , Kyeong Min LEE , Won Young KANG , Kang Sul KIM , Tae-Keun KIM
CPC classification number: H01L21/67051 , H01L21/02052
Abstract: An exemplary embodiment of the present invention provides a substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate; and supplying a rinse liquid onto the substrate.
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公开(公告)号：US20240222165A1
公开(公告)日：2024-07-04
申请号：US18539634
申请日：2023-12-14
Applicant: SEMES CO., LTD.
Inventor： Hee Man AHN , Gyeong Won SONG , Min Hee CHO , Ju Mi LEE , Byung Hwi KIM , Chun Woo PARK
IPC: H01L21/67 , H01L21/677
CPC classification number: H01L21/67225 , H01L21/67017 , H01L21/67051 , H01L21/67098 , H01L21/67742
Abstract: The inventive concept provides a substrate treating apparatus which is cool a support plate having a heater faster than a conventional substrate treating apparatus. The substrate treating apparatus includes a housing providing a treating space therein; and a support unit configured to support a substrate at the treating space. The support unit includes a heater member provided at the support plate to heat the substrate and a cooling unit configured to cool the heater member. The cooling unit includes a first gas supply nozzle positioned under an edge of the heater member for supplying a cooling gas to a center direction of a bottom surface of the heater member and a second gas supply nozzle positioned under a center of the heater member for supplying the cooling gas in an edge direction of the bottom surface of the heater member.
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Patent Agency Ranking
公开(公告)号：US20230405645A1
公开(公告)日：2023-12-21
申请号：US17826729
申请日：2022-05-27
Applicant: SEMES CO., LTD.
Inventor： Kyeong Min LEE , Tae-Keun KIM , Min Hee CHO , Won Young KANG
CPC classification number: B08B7/0014 , B08B3/10
Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.
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公开(公告)号：US20230201942A1
公开(公告)日：2023-06-29
申请号：US18145125
申请日：2022-12-22
Applicant: SEMES CO., LTD.
Inventor： Min Hee CHO , Jun Ho SONG
CPC classification number: B23K1/0016 , B23K37/0408 , B25B11/002 , H01L21/6875
Abstract: The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.
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公开(公告)号：US20230171853A1
公开(公告)日：2023-06-01
申请号：US17865976
申请日：2022-07-15
Applicant: SEMES CO., LTD.
Inventor： Min Hee CHO , Won Young KANG , Jun Ho SONG
CPC classification number: H05B3/0004 , G01K13/02 , H05B3/03 , H05B3/40
Abstract: A heating device capable of heating a processing liquid stably and efficiently is provided. The heating device comprises a first unit heater including a first flow path, a second unit heater including a second flow path, and a first tube connecting the first unit heater and the second unit heater, wherein a processing liquid flows through the first flow path, the first tube, and the second flow path, and is heated by the first unit heater and the second unit heater, wherein the first unit heater comprises a first pipe extending along a first direction and including the first flow path formed therein along the first direction, a first input terminal formed on a surface of the first pipe and extending in the first direction, a first output terminal formed on a surface of the first pipe, extending in the first direction, and spaced apart from the first input terminal, a plurality of first heating wires spaced apart from each other, formed on a surface of the first pipe, and connecting the first input terminal and the first output terminal.
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公开(公告)号：US20230166302A1
公开(公告)日：2023-06-01
申请号：US18058570
申请日：2022-11-23
Applicant: SEMES CO., LTD.
Inventor： Jun Ho SONG , Min Hee CHO , Won Young KANG
CPC classification number: B08B3/10 , B08B3/08 , B08B3/022 , B08B3/041 , B08B13/00 , F24H1/122 , H05B3/48 , B08B2203/007 , H01L21/67051
Abstract: Provided is a liquid supply unit for supplying a treatment liquid to a nozzle that discharges the treatment liquid to a substrate, the liquid supply unit including: a tank for storing the treatment liquid; a main circulation line for supplying the treatment liquid from an internal space of the tank to the nozzle or for recovering the treatment liquid to the internal space of the tank; a supply line connected to the main circulation line to supply the treatment liquid to the nozzle; and a heater module installed in the main circulation line and heating the treatment liquid flowing through the main circulation line to a predetermined temperature, in which the heater module includes: a pipe in which the treatment liquid flows and which is made of a quartz material; and a heating element provided on a surface of the pipe.
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公开(公告)号：US20230408200A1
公开(公告)日：2023-12-21
申请号：US18143273
申请日：2023-05-04
Applicant: SEMES CO., LTD.
Inventor： Ju Mi LEE , Gyeong Won SONG , Min Hee CHO , Byung Hwi KIM , Chun Woo PARK , Hee Man AHN
CPC classification number: F27D9/00 , G03F7/40 , F27D2009/0078
Abstract: The substrate processing apparatus of the present invention comprises a hot plate for heating a substrate; and a cooling unit for cooling the hot plate; wherein the cooling unit includes a support plate having a space formed between the support plate and the hot plate, and a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate, wherein an outdoor air inlet passage provided in a through structure is provide in the support plate, wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.
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