Unit for supplying substrate treating liquid and apparatus for treating substrate including the same

    公开(公告)号:US12119241B2

    公开(公告)日:2024-10-15

    申请号:US17879012

    申请日:2022-08-02

    CPC classification number: H01L21/67051 B41J2/16517 H01L21/67253

    Abstract: A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

    INK TREATMENT APPARATUS AND METHOD
    2.
    发明公开

    公开(公告)号:US20240217243A1

    公开(公告)日:2024-07-04

    申请号:US18302323

    申请日:2023-04-18

    CPC classification number: B41J2/17596 B41J29/393

    Abstract: An ink treatment apparatus and method are provided. The ink treatment apparatus includes: a reservoir storing ink; a head module ejecting the ink; a first control valve controlling a flow of the ink; a plurality of fluid transfer lines installed between the reservoir and the head module and having the ink flow therein; a pump installed in the fluid transfer lines to pump the ink; a flow rate measurement module installed in the fluid transfer line, the flow rate measurement module measuring a flow rate of the ink in accordance with the flow of the ink and providing ink flow rate information that is information regarding the flow rate of the ink; and a control module controlling a circulation ratio of the ink between the fluid transfer lines by controlling the pump and the first control valve based on the ink flow rate information.

    Degassing apparatus and substrate treating apparatus

    公开(公告)号:US11673075B2

    公开(公告)日:2023-06-13

    申请号:US17468800

    申请日:2021-09-08

    Inventor: Dae Sung Kim

    CPC classification number: B01D19/0094 G03F7/70858

    Abstract: Disclosed is a degassing apparatus. The degassing apparatus includes a dissolved gas extracting nozzle that extracts dissolved gases in a form of bubbles from a treatment solution including the dissolved gases, a first tank that separates the bubbles extracted while passing through the dissolved gas extracting nozzle from the treatment solution, and a second tank having a stabilization space, in which the treatment solution, from which the bubbles have been separated, is stored from the first tank and is stabilized. The dissolved gas extracting nozzle is configured such that a diameter of an outlet is smaller than a diameter of an intermediate passage such that the dissolved gases in the treatment solution are extracted in the form of the bubbles through a cavitation phenomenon.

    SYSTEM FOR SUPPLYING PHOTORESIST AND METHOD FOR MANAGING PHOTORESIST

    公开(公告)号:US20230176482A1

    公开(公告)日:2023-06-08

    申请号:US18060629

    申请日:2022-12-01

    CPC classification number: G03F7/16 B05C11/1026 B05C11/1013 B05C11/1036

    Abstract: Provided is a system for supplying a photoresist. In an embodiment, a system for supplying a photoresist includes a pressure adjustment container provided to a supply line connected from a chemical liquid bottle to a first tank, and the pressure adjustment container includes a housing having a space formed therein, a separator separating the space of the housing into a first space and a second space, an inflow port making a photoresist flow in the first space, a discharge port discharging the photoresist from the first space, and a pressurized fluid inflow port supplying a pressurized fluid to the second space, and a volume of the first space varies depending on the supply of the pressurized fluid.

    UNIT FOR SUPPLYING SUBSTRATE TREATING LIQUID AND APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME

    公开(公告)号:US20230068426A1

    公开(公告)日:2023-03-02

    申请号:US17879012

    申请日:2022-08-02

    Abstract: A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

    Substrate treating liquid supply unit and substrate treating apparatus including the same

    公开(公告)号:US12269273B2

    公开(公告)日:2025-04-08

    申请号:US17851029

    申请日:2022-06-28

    Abstract: Provided are a substrate treating liquid supply unit for constantly maintaining a liquid level of a nozzle of an inkjet head unit through real-time water level measurement, and a substrate treating apparatus including the same. The substrate treating liquid supply unit includes: a first reservoir connected to an inkjet head unit for jetting a substrate treating liquid onto a substrate and providing the substrate treating liquid to the inkjet head unit; a water level sensor measuring a water level of the substrate treating liquid stored in the first reservoir; and a pressure control module compensating for a pressure provided to the first reservoir based on an amount variation in the water level of the substrate treating liquid, wherein a liquid level of a nozzle of the inkjet head unit is constantly maintained.

    SUBSTRATE TREATING LIQUID SUPPLY UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230031300A1

    公开(公告)日:2023-02-02

    申请号:US17851029

    申请日:2022-06-28

    Abstract: Provided are a substrate treating liquid supply unit for constantly maintaining a liquid level of a nozzle of an inkjet head unit through real-time water level measurement, and a substrate treating apparatus including the same. The substrate treating liquid supply unit includes: a first reservoir connected to an inkjet head unit for jetting a substrate treating liquid onto a substrate and providing the substrate treating liquid to the inkjet head unit; a water level sensor measuring a water level of the substrate treating liquid stored in the first reservoir; and a pressure control module compensating for a pressure provided to the first reservoir based on an amount variation in the water level of the substrate treating liquid, wherein a liquid level of a nozzle of the inkjet head unit is constantly maintained.

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