公开(公告)号：US20240145265A1

公开(公告)日：2024-05-02

申请号：US18141416

申请日：2023-04-29

Applicant: SEMES CO., LTD.

Inventor： Young Seop CHOI ,  Myung A JEON ,  Dong Uk LEE ,  Boo Seok YANG ,  Bok Kyu LEE

IPC: H01L21/67 ,  B08B3/10

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B2203/005 ,  B08B2203/007

Abstract: Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.