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公开(公告)号：US20240091822A1
公开(公告)日：2024-03-21
申请号：US18239503
申请日：2023-08-29
Applicant: SEMES CO., LTD.
Inventor： Byungwoo SIM , Bok Kyu LEE
CPC classification number: B08B3/10 , B08B3/022 , B08B3/08 , B08B13/00 , B08B2203/002
Abstract: Provided are a liquid chemical tank module and a liquid chemical supply apparatus, the liquid chemical tank module including a tank body having a storage space capable of storing a liquid chemical, a gas ejector for ejecting an inert gas into the liquid chemical to reduce dissolved oxygen in the liquid chemical of the tank body, and a controller for applying a control signal to the gas ejector to control a flow rate of the inert gas, wherein the gas ejector includes a gas pipe extending into the storage space and at least partially dipped in the liquid chemical to supply the inert gas from outside of the tank body into the storage space, and a plurality of ejection nozzles along the extension direction of the gas pipe to eject the inert gas into the storage space or the liquid chemical in the storage space.
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公开(公告)号：US20160118241A1
公开(公告)日：2016-04-28
申请号：US14879389
申请日：2015-10-09
Applicant: Semes Co., Ltd.
Inventor： Seong Soo LEE , Keunje JO , Soon Kab KWON , Jong Han KIM , Bok Kyu LEE , Yoon-Jong JU
IPC: H01L21/02 , B08B3/10 , B08B3/02 , H01L21/67 , H01L21/687
CPC classification number: B08B3/102 , B08B3/024 , H01L21/67051 , H01L21/6715
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.
Abstract translation: 公开了一种基板处理装置。 基板处理装置包括限定用于在其中处理基板的空间的壳体，支撑并旋转基板在壳体中的旋转头，喷射单元，其包括用于将第一处理溶液喷射在放置在旋转头上的基板上的第一喷嘴构件 ，以及控制喷雾单元的控制器。 控制器喷射第一处理溶液，同时将第一喷嘴构件在衬底的边缘和中心区域之间以及衬底上方移动。 所述控制器不同地调节所述第一处理液喷射到所述基板的边缘区域上的第一高度以及所述第一处理溶液喷射到所述基板的中心区域的第二高度。
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3.发明申请公开(公告)号：US20250046597A1
公开(公告)日：2025-02-06
申请号：US18735356
申请日：2024-06-06
Applicant: SEMES CO., LTD.
Inventor： Hee Hwan KIM , Bok Kyu LEE , Young Hun LEE
Abstract: Disclosed is a method of treating a substrate, the method including: a first pre-wet operation of supplying a first pre-wet liquid to a rotating substrate; a second pre-wet operation of supplying a second pre-wet liquid having a temperature different from the first pre-wet liquid to the rotating substrate, the second pre-wet operation being performed after the first pre-wet operation; and a chemical treatment operation of supplying a chemical that is a liquid of a different type from the first pre-wet liquid and the second pre-wet liquid to the rotating substrate, the chemical treatment operation being performed after the second pre-wet operation.
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公开(公告)号：US20240091683A1
公开(公告)日：2024-03-21
申请号：US18354823
申请日：2023-07-19
Applicant: SEMES CO., LTD.
Inventor： Byungwoo SIM , Bok Kyu LEE
CPC classification number: B01D29/66 , B01D46/0005 , B01D46/0027
Abstract: The present disclosure relates to a filter flushing device and a filter flushing method in which a filter can be flushed and which may include: a main body in which at least one filter can be mounted; a deionized (DI) water supply unit that can selectively supply a plurality of types of DI water having different temperatures to the filter mounted in the main body at desired time intervals, thereby flushing the filter; a drain unit that drains the DI water passing through the filter to the outside of the main body; and a control unit that is electrically connected to the DI water supply unit to apply a control signal to the DI water supply unit so that a temperature and a flow rate of the DI water supplied to the main body through the DI water supply unit can be controlled.
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公开(公告)号：US20250033097A1
公开(公告)日：2025-01-30
申请号：US18758101
申请日：2024-06-28
Applicant: SEMES CO., LTD.
Inventor： Byung Woo SIM , Bok Kyu LEE
Abstract: Disclosed is an apparatus for cleaning a component, the apparatus including: a cleaning fluid supply source; a supply line for receiving cleaning fluid from the cleaning fluid supply source and connected with a first port of the component; a discharge line connected with a second port of the component; and a circulation line branched from the discharge line and connected with a third port of the component.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240145265A1
公开(公告)日：2024-05-02
申请号：US18141416
申请日：2023-04-29
Applicant: SEMES CO., LTD.
Inventor： Young Seop CHOI , Myung A JEON , Dong Uk LEE , Boo Seok YANG , Bok Kyu LEE
CPC classification number: H01L21/67051 , B08B3/10 , B08B2203/005 , B08B2203/007
Abstract: Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.
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公开(公告)号：US20230339790A1
公开(公告)日：2023-10-26
申请号：US17985038
申请日：2022-11-10
Applicant: SEMES CO., LTD.
Inventor： Myung A JEON , Young Seop CHOI , Bok Kyu LEE , Kyu Hwan CHANG , Yong Sun KO
IPC: C02F1/78
CPC classification number: C02F1/78 , C02F2301/08 , C02F2305/023 , C02F2103/346
Abstract: Provided are an ozone water decomposition apparatus and method that can decompose ozone water quickly and stably. The ozone water decomposition apparatus, comprising: a tank configured to accommodate ozone water and decompose the ozone water; a first supply unit configured to supply the ozone water to the tank; a second supply unit configured to supply an additive to the tank wherein the additive is supplied by a preset first or second supply amount; a circulation line configured to circulate the ozone water in the tank; and a concentration meter installed in the circulation line, wherein the ozone water decomposition apparatus comprises: after circulating the ozone water using the circulation line, measuring an ozone concentration of the ozone water using the concentration meter; subsequently supplying the additive of the first supply amount or the second supply amount based on the measured ozone concentration of the ozone water; and subsequently circulating the ozone water until the ozone concentration of the ozone water reaches a preset reference concentration.
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公开(公告)号：US20250041911A1
公开(公告)日：2025-02-06
申请号：US18791839
申请日：2024-08-01
Applicant: SEMES CO., LTD.
Inventor： Myung A JEON , Yong Hoon HONG , Ji Su HONG , Bok Kyu LEE , Young Seop CHOI
Abstract: Disclosed is an ozone water supplying unit capable of maintaining a stable ozone concentration of ozone water supplied to a substrate, and a substrate treating apparatus including the same. The substrate treating apparatus includes: a chamber for liquid-treating a substrate loaded into a treating space with a liquid containing ozone water; and an ozone water supplying unit for supplying ozone water to the treating space, in which the ozone water supplying unit includes: an ozone water generator for generating ozone water; an ozone water supply line for supplying ozone water generated by the ozone water generator to the treating space; and a cooler provided in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.
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公开(公告)号：US20240412986A1
公开(公告)日：2024-12-12
申请号：US18594391
申请日：2024-03-04
Applicant: SEMES CO., LTD.
Inventor： Byung Woo SIM , Bok Kyu LEE
IPC: H01L21/67 , B08B3/02 , H01L21/02 , H01L21/306
Abstract: Provided are a substrate processing apparatus and a substrate processing method that are capable of maintaining an etch rate of a substrate within a predetermined range by preventing the amount of dissolved oxygen from being concentrated in a specific region of the substrate when a chemical is supplied to a center of the substrate. The apparatus for processing a substrate includes: a chamber having a processing space; a support unit for supporting and rotating a substrate in the processing space; a liquid discharge unit including a nozzle for discharging a treatment liquid onto a substrate supported by the support unit in a liquid phase; and a liquid supply unit for supplying the treatment liquid to the liquid discharge unit, in which, when viewed from above, the nozzle is spaced apart from a center of the substrate such that when the treatment liquid is supplied to the substrate rotated by the support unit, the treatment liquid is not sprayed by the nozzle at a position overlapping the center of the substrate.
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公开(公告)号：US20240210836A1
公开(公告)日：2024-06-27
申请号：US18501265
申请日：2023-11-03
Applicant: SEMES CO., LTD.
Inventor： Myung A JEON , Young Seop CHOI , Bok Kyu LEE , Joo Sung LEE , Je Myung CHA
IPC: G03F7/42
CPC classification number: G03F7/422 , H01L21/67051
Abstract: Provided is a substrate processing apparatus and method capable of improving photoresist removal efficiency by using two different types of chemical liquids. The substrate processing apparatus comprises a substrate support unit for supporting and rotating a substrate; and a spray unit for discharging a substrate processing liquid onto the substrate using a nozzle structure, wherein the nozzle structure comprises a first inlet pipe for providing a first chemical liquid; a second inlet pipe for providing a second chemical liquid;
a reaction space module where the first chemical liquid and the second chemical liquid are mixed; and a discharge pipe for discharging a mixture solution of the first chemical liquid and the second chemical liquid into the substrate processing liquid, wherein the first chemical liquid contains ozone gas, and the second chemical liquid contains an OH component.
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