公开(公告)号：US20240216940A1

公开(公告)日：2024-07-04

申请号：US18342797

申请日：2023-06-28

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Eun Jung LEE ,  Jun Hyun LIM

IPC: B05C9/06 ,  B05C11/10 ,  B05C13/02 ,  B05D1/22

CPC classification number: B05C9/06 ,  B05C11/1042 ,  B05C13/02 ,  B05D1/22

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a liquid treating chamber; a support configured to support a substrate within the liquid treating chamber; a first treating liquid supply unit configured to supply a first treating liquid to the liquid treating chamber to treat the substrate with the first treating liquid; and a second treating liquid supply unit configured to supply a second treating liquid to the liquid treating chamber to treat the substrate with the second treating liquid, and wherein the second treating liquid supply unit includes a cooler for cooling the second treating liquid.

公开(公告)号：US20240203761A1

公开(公告)日：2024-06-20

申请号：US18391599

申请日：2023-12-20

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN

IPC: H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/67057

Abstract: There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.

公开(公告)号：US20240222174A1

公开(公告)日：2024-07-04

申请号：US18395570

申请日：2023-12-24

Applicant: SEMES CO., LTD.

Inventor： Seul Gi CHOI ,  Jun Hyun LIM ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN ,  Gui Su PARK

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67712 ,  H01L21/67057 ,  H01L21/67706

Abstract: Proposed is a substrate transferring apparatus, and a liquid processing apparatus and substrate processing equipment including the same, which prevent a pattern leaning phenomenon during a substrate processing process. The substrate transferring apparatus that transfers substrates between cleaning tanks in the batch-type liquid processing apparatus includes a rail extended on a ceiling of a first cleaning tank in which a first processing liquid is stored and a second cleaning tank in which a second processing liquid is stored, a crane moving along the rail, and a vessel configured to be moved vertically by the crane. The vessel may include a first sub vessel and a second sub vessel that combine with each other to form a space for accommodating a substrate immersed in the first processing liquid.