公开(公告)号：US20240216940A1

公开(公告)日：2024-07-04

申请号：US18342797

申请日：2023-06-28

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Eun Jung LEE ,  Jun Hyun LIM

IPC: B05C9/06 ,  B05C11/10 ,  B05C13/02 ,  B05D1/22

CPC classification number: B05C9/06 ,  B05C11/1042 ,  B05C13/02 ,  B05D1/22

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a liquid treating chamber; a support configured to support a substrate within the liquid treating chamber; a first treating liquid supply unit configured to supply a first treating liquid to the liquid treating chamber to treat the substrate with the first treating liquid; and a second treating liquid supply unit configured to supply a second treating liquid to the liquid treating chamber to treat the substrate with the second treating liquid, and wherein the second treating liquid supply unit includes a cooler for cooling the second treating liquid.

公开(公告)号：US20240203761A1

公开(公告)日：2024-06-20

申请号：US18391599

申请日：2023-12-20

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Eun Jung LEE ,  Hee Jun YOUN

IPC: H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/67057

Abstract: There are provided a substrate treating apparatus and method for etch rate deviation improvement. The substrate treating apparatus includes: a treating bath providing space for receiving a substrate treating solution for treating substrates; a treating solution source providing the substrate treating solution into the treating bath such that the substrates are immersed and treated in the substrate treating solution; and a bubble generation module connected to the treating bath and generating bubbles in the substrate treating solution by injecting gas.

公开(公告)号：US20230147919A1

公开(公告)日：2023-05-11

申请号：US17980995

申请日：2022-11-04

Applicant: SEMES CO., LTD.

Inventor： Gui Su PARK ,  Jun Young CHOI ,  Young Jin JANG ,  Yong Sun KO ,  Kyu Hwan CHANG ,  Jun Hyun LIM

IPC: H01L21/677 ,  H01L21/687 ,  B08B3/08 ,  B08B13/00 ,  G03F7/20 ,  F26B5/00

CPC classification number: H01L21/67718 ,  H01L21/68707 ,  B08B3/08 ,  B08B13/00 ,  G03F7/2043 ,  F26B5/005 ,  B25J11/0095

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.

公开(公告)号：US20230110780A1

公开(公告)日：2023-04-13

申请号：US17960392

申请日：2022-10-05

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Yong Sun KO ,  Jun Hyun LIM ,  Gui Su PARK ,  Young Jin JANG

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683

Abstract: The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

公开(公告)号：US20230096569A1

公开(公告)日：2023-03-30

申请号：US17952774

申请日：2022-09-26

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI ,  Gui Su PARK ,  Young Jin JANG ,  Jun Hyun LIM

IPC: H01L21/677 ,  H01L21/687 ,  B08B3/04 ,  B08B13/00 ,  B25J11/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

公开(公告)号：US20220117071A1

公开(公告)日：2022-04-14

申请号：US17467962

申请日：2021-09-07

Applicant: SEMES CO., LTD.

Inventor： Jun Young CHOI

IPC: H05F3/02 ,  H01L21/67 ,  H01L21/687

Abstract: A method for treating a substrate includes treating the substrate by dispensing a chemical solution onto the substrate while rotating the substrate, in which a grounded conductive member that makes direct contact with the substrate or the chemical solution is included in a support unit that supports and rotates the substrate, a current detector is provided on a ground path between the grounded conductive member and a ground, and a treatment condition for the substrate is controlled based on a current value detected by the current detector.

公开(公告)号：US20240217114A1

公开(公告)日：2024-07-04

申请号：US18343774

申请日：2023-06-29

Applicant: SEMES CO., LTD.

Inventor： Hee Jun YOUN ,  Jun Young CHOI

IPC: B25J11/00 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J11/0085 ,  B25J15/0028 ,  B25J15/009

Abstract: The inventive concept provides a substrate transfer robot. The substrate transfer robot includes a fastening body; a support body protruding to a front from the fastening body, and supporting a bottom surface of the substrate if the substrate is positioned in a first posture; a gripper member coupled to the fastening body and relatively movable with respect to the support body; and a gripper driver moving the gripper member between a first position and a second position, and wherein the gripper member includes: a first gripper positioned at a side of the support body; and a second gripper positioned at another side of the support body, and wherein an alignment pin for aligning a position of the substrate is installed at the support body, and if a position at which the substrate is aligned with the support body is referred to as a reference position, the first position is a position at which the first gripper and the second gripper contact a substrate positioned at the reference position to grip the substrate, and the second position is a position at which the first gripper and the second gripper are spaced apart from the substrate positioned at the reference position, and the first posture is a posture that a top surface of the substrate is horizontal to the ground.