公开(公告)号：US20210090911A1

公开(公告)日：2021-03-25

申请号：US17026504

申请日：2020-09-21

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon HONG ,  Heehwan KIM ,  Ji Young LEE

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B13/00

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate and a nozzle unit having a nozzle that dispenses a chemical onto the substrate, in which the nozzle is connected with a ground line, and a variable resistor is provided on the ground line.

公开(公告)号：US20170312794A1

公开(公告)日：2017-11-02

申请号：US15491491

申请日：2017-04-19

Applicant: SEMES CO., LTD.

Inventor： Jeong Yeong PARK ,  Kang Suk LEE ,  Heehwan KIM

IPC: B08B3/10 ,  B08B3/08 ,  B08B3/04 ,  H01L21/67 ,  H01L21/02

CPC classification number: B08B3/106 ,  B08B3/041 ,  B08B3/08 ,  B08B2203/007 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67017 ,  H01L21/67051

Abstract: Provided is a substrate treating apparatus comprising: a support unit for supporting the substrate; a discharge unit for discharging an organic solvent to the substrate supported on the support unit; and a solvent supply unit for supplying the organic solvent in a liquid state to the discharge unit at atmospheric pressure to a temperature higher than the boiling point of the organic solvent.

公开(公告)号：US20210066099A1

公开(公告)日：2021-03-04

申请号：US17011048

申请日：2020-09-03

Applicant: SEMES CO., LTD.

Inventor： Muhyeon LEE ,  Byungsun BANG ,  Heehwan KIM

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/10

Abstract: A method for processing a substrate includes a liquid treatment step of performing liquid treatment on the substrate by dispensing a treatment liquid onto the rotating substrate and a cleaning step of stopping the dispensing of the treatment liquid and dispensing a cleaning solution onto the substrate. In the cleaning step, a first liquid is dispensed from a first nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a first direction, and a second liquid is dispensed from a second nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a second direction. When viewed from above, the first liquid flows toward the second nozzle after dispensed onto the substrate, and the second liquid flows toward the first nozzle after dispensed onto the substrate.

公开(公告)号：US20210130951A1

公开(公告)日：2021-05-06

申请号：US17086061

申请日：2020-10-30

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon HONG ,  Dohyeon YOON ,  Heehwan KIM ,  Ji Young LEE ,  Young Su KIM

IPC: C23C16/448 ,  C23C16/44 ,  C23C16/52 ,  C23C16/455

Abstract: A chemical supply apparatus includes an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto, a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit, a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical, and a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is disposed between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles.

公开(公告)号：US20180061675A1

公开(公告)日：2018-03-01

申请号：US15677321

申请日：2017-08-15

Applicant: SEMES CO., LTD.

Inventor： Heehwan KIM ,  Sul LEE

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/68721 ,  H01L21/68735

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.