公开(公告)号：US20180061675A1

公开(公告)日：2018-03-01

申请号：US15677321

申请日：2017-08-15

Applicant: SEMES CO., LTD.

Inventor： Heehwan KIM ,  Sul LEE

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/68721 ,  H01L21/68735

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.

公开(公告)号：US20210335596A1

公开(公告)日：2021-10-28

申请号：US17239091

申请日：2021-04-23

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon HONG ,  Sul LEE ,  Myung A JEON ,  Moonsik CHOI ,  Young Su KIM

IPC: H01L21/02 ,  H01L21/263

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

公开(公告)号：US20160089686A1

公开(公告)日：2016-03-31

申请号：US14862729

申请日：2015-09-23

Applicant: Semes Co., Ltd.

Inventor： Sul LEE ,  Young Hun JUNG ,  Jong Su CHOI

IPC: B05C5/02 ,  B05D1/00 ,  B05D1/02 ,  B05C11/08 ,  B05B3/00

CPC classification number: B05D1/002 ,  H01L21/6708

Abstract: In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.

Abstract translation: 在根据本发明构思的示例性实施方案的设备和方法中，可以使用两种或更多种处理溶液来处理衬底。 基板处理装置可以包括提供处理空间的处理容器，设置在处理容器中以支撑基板的基板支撑单元，以及在由基板支撑单元支撑的基板上供给处理溶液的溶液供给单元。 溶液供给单元可以包括在由基板支撑单元支撑的基板的边缘区域上提供蚀刻溶液的蚀刻溶液供应喷嘴和在基板的中心区域上提供防腐蚀溶液的防蚀溶液（EPS）供应喷嘴 由基板支撑单元支撑。 因此，可以防止基板的中心区域被干燥。