公开(公告)号：US20230133714A1

公开(公告)日：2023-05-04

申请号：US17976996

申请日：2022-10-31

Applicant: SEMES CO., LTD.

Inventor： Dong Uk KIM ,  In Hoe KIM ,  Hyoung Kyu SON

IPC: H01J37/32 ,  H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space; a separation unit provided at the inner space and configured to be combined with the chamber to divide the inner space into a plurality of treating spaces and a transfer space; a plurality of support units provided at each of the plurality of treating spaces and configured to support a substrate; a plurality of gas supply units provided at each of the plurality of treating spaces and configured to supply a process gas to the substrate supported on the plurality of support units; and a transfer unit provided at the transfer space and configured to transfer the substrate between the plurality of treating spaces.

公开(公告)号：US20240203690A1

公开(公告)日：2024-06-20

申请号：US18540731

申请日：2023-12-14

Applicant: SEMES CO., LTD.

Inventor： Hyoung Kyu SON ,  Sang Hyun PARK ,  Yun Sang KIM ,  Yoon Seok CHOI ,  Ju Yong JANG

IPC: H01J37/32

CPC classification number: H01J37/32155 ,  H01J37/3211 ,  H01J2237/002 ,  H01J2237/327

Abstract: Proposed is a substrate treatment apparatus and a plasma density control method, and relates to a technology of controlling non-uniformity of plasma density in a substrate treatment process using plasma so that a plasma sheath is adjusted, thereby precisely controlling the substrate treatment process.

公开(公告)号：US20220208516A1

公开(公告)日：2022-06-30

申请号：US17564281

申请日：2021-12-29

Applicant: SEMES CO., LTD.

Inventor： Hyoung Kyu SON

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/46

Abstract: A gas distribution assembly provided in an apparatus for treating a substrate with plasma to distribute gas includes a gas distribution plate formed with a plurality of gas introduction holes for diffusing gas supplied from the gas supply unit; a shower head plate disposed at the upper portion or lower portion of the gas distribution plate to be in contact with the gas distribution plate and having a plurality of gas supply holes formed at positions communicating with the gas introduction holes to penetrate through the upper surface and the lower surface; and a fastening member provided at a side surface in contact with the gas distribution plate and the shower head plate and including a first coupling portion coupled to the gas distribution plate and a second coupling portion supporting the lower surface of the shower head plate to contact the gas distribution plate and the shower head plate.

公开(公告)号：US20200277702A1

公开(公告)日：2020-09-03

申请号：US16802559

申请日：2020-02-27

Applicant: SEMES CO., LTD.

Inventor： Hyoung Kyu SON ,  Jin Hyun LEE

IPC: C23C16/455 ,  C23C16/458

Abstract: A gas supplying unit of a substrate treating apparatus is proposed. The gas supplying unit includes: a gas distribution plate having a first surface and a second surface opposite the first surface, and having first gas supply holes formed through the first surface and the second surface; a shower head having a third surface being in close contact with the second surface and a fourth surface opposite the third surface, and having second gas supply holes formed through the third surface and the fourth surface to be connected to the first gas supply holes; and heat transfer members having first ends inserted in at least one of the gas distribution plate and the shower head and second ends being in contact with any one of the shower head and the gas distribution plate.

公开(公告)号：US20230215706A1

公开(公告)日：2023-07-06

申请号：US18148078

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Hyun Woo JO ,  Sang Jeong LEE ,  Jong Won PARK ,  Hyoung Kyu SON

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01J37/32715 ,  H01J37/32642 ,  H01L21/68742 ,  H01L21/6833 ,  H01J2237/20235 ,  H01J2237/2007 ,  H01J2237/002 ,  H01J2237/334

Abstract: The inventive concept provides a substrate support unit. The substrate support unit includes a susceptor supporting the substrate and having a pinhole formed vertically; and a lift pin unit configured to load and unload the substrate on the susceptor, and wherein the lift pin unit includes: a lift pin vertically movable along the pinhole; a support vertically movable by a driving unit; a pin holder connecting the support and the lift pin, and wherein the lift pin is pivotably connected to the pin holder and the pin holder is laterally movable with respect to the support.