公开(公告)号：US20230352319A1

公开(公告)日：2023-11-02

申请号：US18302287

申请日：2023-04-18

Applicant: SEMES CO., LTD.

Inventor： Jun Seok LEE ,  Beomjeong OH ,  Subeom JEON ,  Jeong Ho JO

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/02052

Abstract: Provided is a treatment liquid ejection method and apparatus capable of significantly increasing productivity and quality by greatly reducing a maintenance time of a head unit, the treatment liquid ejection method including (a) obtaining test image information by test-photographing a treatment liquid test-printed by a head unit, (b) generating nozzle-specific characteristic information by using the test image information, (c) generating print file information to be printed, in consideration of the nozzle-specific characteristic information, (d) reflecting recipe information of a substrate or the head unit to prepare the print file information in an outputtable state, and (e) printing, on the substrate by the head unit, the print file information to which the recipe information is reflected.

公开(公告)号：US20240042753A1

公开(公告)日：2024-02-08

申请号：US18228665

申请日：2023-07-31

Applicant: SEMES CO., LTD.

Inventor： Jeong Ho JO ,  Ji Eun YI

IPC: B41J2/045 ,  B41J2/21

CPC classification number: B41J2/0451 ,  B41J2/2142

Abstract: Provided are a substrate treatment apparatus and method which reconstruct a compensation nozzle map by processing nozzles in a specific area among all nozzles as unused nozzles. The substrate treatment apparatus includes: a process processing unit supporting a substrate while the substrate is being treated; an inkjet head unit including a plurality of nozzles and jetting a substrate treatment liquid onto the substrate to treat the substrate; a gantry unit moving the inkjet head unit on the substrate; and a controller controlling the nozzles, wherein the controller compensates for an abnormal nozzle by not using normal nozzles.