TREATMENT LIQUID EJECTION METHOD AND APPARATUS

    公开(公告)号:US20230352319A1

    公开(公告)日:2023-11-02

    申请号:US18302287

    申请日:2023-04-18

    CPC classification number: H01L21/67051 H01L21/6715 H01L21/02052

    Abstract: Provided is a treatment liquid ejection method and apparatus capable of significantly increasing productivity and quality by greatly reducing a maintenance time of a head unit, the treatment liquid ejection method including (a) obtaining test image information by test-photographing a treatment liquid test-printed by a head unit, (b) generating nozzle-specific characteristic information by using the test image information, (c) generating print file information to be printed, in consideration of the nozzle-specific characteristic information, (d) reflecting recipe information of a substrate or the head unit to prepare the print file information in an outputtable state, and (e) printing, on the substrate by the head unit, the print file information to which the recipe information is reflected.

    LIQUID DROP DISCHARGE APPARATUS
    2.
    发明申请

    公开(公告)号:US20210001626A1

    公开(公告)日:2021-01-07

    申请号:US16920359

    申请日:2020-07-02

    Abstract: A liquid drop discharge apparatus is proposed. The liquid drop discharge apparatus includes: an inkjet head discharging ink to each of pixels of a substrate; a laser emitter coupled to the inkjet head, and emitting an aiming laser beam by which a discharged position of a liquid drop from the inkjet head to each of the pixels is aimed; a camera capturing an emitted position of the aiming laser beam on the substrate; and a position alignment unit aligning a position of the inkjet head on the basis of image data obtained from the shooting unit.

    CHAMBER MODULE AND TEST HANDLER INCLUDING THE SAME

    公开(公告)号:US20220065920A1

    公开(公告)日:2022-03-03

    申请号:US17406751

    申请日:2021-08-19

    Abstract: A chamber module and a test handler including the same are disclosed. The chamber module includes a soak chamber providing a temperature adjusting space for adjusting a temperature of semiconductor devices, an elevating member disposed in the soak chamber and for elevating a tray in which the semiconductor devices are accommodated, a guide member extending in a vertical direction in the soak chamber and for guiding movement of the elevating member, and a temperature adjusting part for adjusting a temperature of the guide member.

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