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公开(公告)号：US12234555B2
公开(公告)日：2025-02-25
申请号：US17503741
申请日：2021-10-18
Applicant: SEMES CO., LTD.
Inventor： Jin Mo Jae , Seung Hoon Oh , Young Seop Choi , Mi So Park , Jong Hyeon Woo
IPC: C23C18/16 , H01L21/67 , H01L21/687
Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.
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公开(公告)号：US12272543B2
公开(公告)日：2025-04-08
申请号：US18068917
申请日：2022-12-20
Applicant: SEMES CO., LTD.
Inventor： Yong Hyun Choi , Young Hun Lee , Seung Hoon Oh , Mi So Park , Tae Jong Choi , Yong Sun Ko , Jin Woo Jung
Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
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