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公开(公告)号:US20230201883A1
公开(公告)日:2023-06-29
申请号:US18068869
申请日:2022-12-20
Applicant: SEMES CO., LTD.
Inventor: Yong Hyun Choi , Young Hun Lee , Yong Joon Im , Seung Hoon Oh , Tae Jong Choi , Yong Sun Ko , Sang Min Lee , Jin Woo Jung
CPC classification number: B08B3/022 , H01L21/67173 , H01L21/68707 , B08B13/00 , B25J11/0095 , F26B3/283
Abstract: Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.
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公开(公告)号:US12272543B2
公开(公告)日:2025-04-08
申请号:US18068917
申请日:2022-12-20
Applicant: SEMES CO., LTD.
Inventor: Yong Hyun Choi , Young Hun Lee , Seung Hoon Oh , Mi So Park , Tae Jong Choi , Yong Sun Ko , Jin Woo Jung
Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
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公开(公告)号:US12222159B2
公开(公告)日:2025-02-11
申请号:US17408953
申请日:2021-08-23
Applicant: SEMES CO., LTD.
Inventor: Do Hyeon Yoon , Yong Hyun Choi , Eui Sang Lim , Jun Young Choi
Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.
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