公开(公告)号：US20230207306A1

公开(公告)日：2023-06-29

申请号：US18145920

申请日：2022-12-23

Applicant: SEMES CO., LTD.

Inventor： Do Gyeong HA ,  Moon Soon CHOL ,  Young Joon Han ,  Seung Tae YANG

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B13/00

CPC classification number: H01L21/02057 ,  H01L21/67051 ,  H01L21/68764 ,  B08B3/022 ,  B08B13/00 ,  B08B2203/027

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.