公开(公告)号：US20230131576A1

公开(公告)日：2023-04-27

申请号：US17969155

申请日：2022-10-19

Applicant: SEMES CO., LTD.

Inventor： Do Gyeong HA ,  Tae Suk YUN ,  Moon Soon CHOI ,  Gu Yeol AN ,  Chae Young LIM ,  Bu Young JUNG

IPC: H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

公开(公告)号：US20230089188A1

公开(公告)日：2023-03-23

申请号：US17941526

申请日：2022-09-09

Applicant: SEMES CO., LTD.

Inventor： Moon Soon CHOI ,  Chae Young LIM ,  Do Gyeong HA ,  Gu Yeol AN

IPC: B05B9/04

Abstract: The inventive concept provides a liquid storage unit. The liquid storage unit includes a tank housing defining a storing space therein; a liquid outlet pipe penetrating into the tank housing and having an outlet formed thereon; and a liquid inlet pipe penetrating into the tank housing and having an inlet formed thereon, and wherein a first guide surface is provided between the outlet and the inlet.

公开(公告)号：US20230207306A1

公开(公告)日：2023-06-29

申请号：US18145920

申请日：2022-12-23

Applicant: SEMES CO., LTD.

Inventor： Do Gyeong HA ,  Moon Soon CHOL ,  Young Joon Han ,  Seung Tae YANG

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B13/00

CPC classification number: H01L21/02057 ,  H01L21/67051 ,  H01L21/68764 ,  B08B3/022 ,  B08B13/00 ,  B08B2203/027

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

公开(公告)号：US20230173438A1

公开(公告)日：2023-06-08

申请号：US17952446

申请日：2022-09-26

Applicant: SEMES CO., LTD.

Inventor： Gu Yeol AN ,  Do Gyeong HA ,  Moon Soon CHOI ,  Bu Young JUNG ,  Kyung Hun LEE ,  Chae Young LIM

IPC: B01F25/10 ,  B01F23/40 ,  B01F25/46 ,  B01F23/45

CPC classification number: B01F25/104 ,  B01F23/49 ,  B01F25/46 ,  B01F23/452 ,  B01F2101/24

Abstract: An apparatus for processing a substrate includes a mixing nozzle having a mixing space that is shaped as an inverted cone, the mixing nozzle including a first inlet, a second inlet and an outlet installed at the mixing space; a first chemical supply unit connected to the first inlet; a second chemical supply unit connected to the second inlet; and a supply tank connected to the outlet, wherein the first chemical supply unit is configured to supply a first chemical solution to the mixing space through the first inlet, the second chemical supply unit is configured to supply a second chemical solution to the mixing space through the second inlet, and the supply tank is supplied with, through the outlet, a solution mixture that is formed of the first chemical solution and the second chemical solution after being mixed in the mixing space.

公开(公告)号：US20220181169A1

公开(公告)日：2022-06-09

申请号：US17520588

申请日：2021-11-05

Applicant: SEMES CO., LTD.

Inventor： Seung Tae YANG ,  Jong Han KIM ,  Do Gyeong HA

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.