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公开(公告)号:US20240203774A1
公开(公告)日:2024-06-20
申请号:US18536845
申请日:2023-12-12
Applicant: SEMES CO., LTD.
Inventor: Kyo Bong KIM , Ki Won HAN , Sang-Oh KIM , Hee Jae BYUN , Hee Chan KIM , Sang Hyeop LEE
IPC: H01L21/677 , B25J11/00 , B25J15/00 , H01L21/687
CPC classification number: H01L21/67742 , B25J11/0095 , B25J15/0014 , H01L21/68707
Abstract: The inventive concept provides a substrate transfer apparatus. The substrate transfer apparatus includes a base; a first transfer arm configured to have a first arm link connected to the base and a first end effector connected to the first arm link, and which operates between a contract position and an expand position; and a guide member aligning a substrate placed on the first end effector while the first transfer arm backwardly moves from the expand position to the contract position.
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公开(公告)号:US20240139967A1
公开(公告)日:2024-05-02
申请号:US18384639
申请日:2023-10-27
Applicant: SEMES CO., LTD.
Inventor: Sang Hyeop LEE , Ki Won HAN , Sang Oh KIM , Kyo Bong KIM , Hee Chan KIM
CPC classification number: B25J11/0095 , B25J9/1682 , B25J13/088 , B25J15/0014
Abstract: A substrate transport robot capable of enhancing processing speed and avoiding interference with structures and a system including the substrate transport robot are provided. The substrate transport robot includes: one or more robot arms including transfer hands and transferring semiconductor substrates with the transfer hands; an arm driving module coupled to each of the robot arms and controlling the movement of each of the robot arms; and a horizontal/vertical movement module controlling the position movement of the arm driving module, wherein multiple robot arms are provided, and multiple transfer hands are included in each of the multiple robot arms.
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