公开(公告)号：US20240203774A1

公开(公告)日：2024-06-20

申请号：US18536845

申请日：2023-12-12

Applicant: SEMES CO., LTD.

Inventor： Kyo Bong KIM ,  Ki Won HAN ,  Sang-Oh KIM ,  Hee Jae BYUN ,  Hee Chan KIM ,  Sang Hyeop LEE

IPC: H01L21/677 ,  B25J11/00 ,  B25J15/00 ,  H01L21/687

CPC classification number: H01L21/67742 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/68707

Abstract: The inventive concept provides a substrate transfer apparatus. The substrate transfer apparatus includes a base; a first transfer arm configured to have a first arm link connected to the base and a first end effector connected to the first arm link, and which operates between a contract position and an expand position; and a guide member aligning a substrate placed on the first end effector while the first transfer arm backwardly moves from the expand position to the contract position.

公开(公告)号：US20230064141A1

公开(公告)日：2023-03-02

申请号：US17889298

申请日：2022-08-16

Applicant: SEMES CO., LTD.

Inventor： Dong Chan LEE ,  Kyo Bong KIM

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

Abstract: An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

公开(公告)号：US20240139967A1

公开(公告)日：2024-05-02

申请号：US18384639

申请日：2023-10-27

Applicant: SEMES CO., LTD.

Inventor： Sang Hyeop LEE ,  Ki Won HAN ,  Sang Oh KIM ,  Kyo Bong KIM ,  Hee Chan KIM

IPC: B25J11/00 ,  B25J9/16 ,  B25J13/08 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J9/1682 ,  B25J13/088 ,  B25J15/0014

Abstract: A substrate transport robot capable of enhancing processing speed and avoiding interference with structures and a system including the substrate transport robot are provided. The substrate transport robot includes: one or more robot arms including transfer hands and transferring semiconductor substrates with the transfer hands; an arm driving module coupled to each of the robot arms and controlling the movement of each of the robot arms; and a horizontal/vertical movement module controlling the position movement of the arm driving module, wherein multiple robot arms are provided, and multiple transfer hands are included in each of the multiple robot arms.

公开(公告)号：US20240112938A1

公开(公告)日：2024-04-04

申请号：US18134489

申请日：2023-04-13

Applicant: SEMES CO., LTD.

Inventor： Hee Jae BYUN ,  Kyo Bong KIM ,  Chan Young CHOI ,  Wan Hee JEONG ,  Sang Oh KIM

IPC: H01L21/68 ,  B25J11/00 ,  B25J13/08 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J13/08 ,  H01L21/67259 ,  H01L21/68707

Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.