公开(公告)号：US20250164898A1

公开(公告)日：2025-05-22

申请号：US18884071

申请日：2024-09-12

Applicant: SEMES CO., LTD.

Inventor： Ki Won HAN ,  Doo Hyun BAEK ,  Hee Chan KIM ,  Tae Kyung KONG ,  Dong Kyum KIM

IPC: G03F7/00

Abstract: A storage and transfer module includes a module body, a storage and transfer unit disposed in the module body, the storage and transfer unit including a liftable transfer portion, and a storage portion disposed on the outside of the transfer portion, the storage portion having a storage space therein, and a transfer target portion in which a substrate is transferred by the transfer portion. A pair of the storage and transfer units are provided. The pair of storage and transfer units are disposed to oppose each other with the transfer target portion interposed therebetween. A substrate loading portion is disposed on one side of the storage and transfer units.

公开(公告)号：US20240387207A1

公开(公告)日：2024-11-21

申请号：US18630230

申请日：2024-04-09

Applicant: SEMES CO., LTD.

Inventor： Ki Won HAN ,  Hee Chan KIM

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus and a substrate processing method that may increase the amount of substrates produced by preventing a main transfer robot that transfers a substrate between a liquid treatment chamber and a heat treatment chamber from transferring an edge-exposed substrate. The substrate processing apparatus may include: an index module; a buffer module; a treatment module; and an interface module, in which the index module includes: a load port in which a container receiving a substrate is placed; and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module, the buffer module is provided with a buffer in which the substrate is placed, the treatment module includes: a liquid treatment chamber for liquid treating the substrate loaded from the buffer module; a heat treatment chamber for heat treating the substrate received from the buffer module; and a transfer chamber disposed between the liquid treatment chamber and the heat treatment chamber, and provided with a main transfer robot for transferring substrates to the buffer module, the liquid treatment chamber, and the heat treatment chamber, respectively, the interface module includes: an interface frame positioned between the treatment module and an external exposure device; an edge exposure chamber disposed within the interface frame and performing edge exposure processing on the substrate; and an interface robot disposed within the interface frame and transferring the substrate, and each of the main transfer robot and the interface robot loads or unloads the substrate into or from the edge exposure chamber.

公开(公告)号：US20240139967A1

公开(公告)日：2024-05-02

申请号：US18384639

申请日：2023-10-27

Applicant: SEMES CO., LTD.

Inventor： Sang Hyeop LEE ,  Ki Won HAN ,  Sang Oh KIM ,  Kyo Bong KIM ,  Hee Chan KIM

IPC: B25J11/00 ,  B25J9/16 ,  B25J13/08 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J9/1682 ,  B25J13/088 ,  B25J15/0014

Abstract: A substrate transport robot capable of enhancing processing speed and avoiding interference with structures and a system including the substrate transport robot are provided. The substrate transport robot includes: one or more robot arms including transfer hands and transferring semiconductor substrates with the transfer hands; an arm driving module coupled to each of the robot arms and controlling the movement of each of the robot arms; and a horizontal/vertical movement module controlling the position movement of the arm driving module, wherein multiple robot arms are provided, and multiple transfer hands are included in each of the multiple robot arms.

公开(公告)号：US20240203774A1

公开(公告)日：2024-06-20

申请号：US18536845

申请日：2023-12-12

Applicant: SEMES CO., LTD.

Inventor： Kyo Bong KIM ,  Ki Won HAN ,  Sang-Oh KIM ,  Hee Jae BYUN ,  Hee Chan KIM ,  Sang Hyeop LEE

IPC: H01L21/677 ,  B25J11/00 ,  B25J15/00 ,  H01L21/687

CPC classification number: H01L21/67742 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/68707

Abstract: The inventive concept provides a substrate transfer apparatus. The substrate transfer apparatus includes a base; a first transfer arm configured to have a first arm link connected to the base and a first end effector connected to the first arm link, and which operates between a contract position and an expand position; and a guide member aligning a substrate placed on the first end effector while the first transfer arm backwardly moves from the expand position to the contract position.