公开(公告)号：US20230166925A1

公开(公告)日：2023-06-01

申请号：US17750359

申请日：2022-05-22

Applicant: SEMES CO., LTD.

Inventor： Hee Jae BYUN ,  Sang Oh KIM ,  Na Hyun LEE ,  Myung Jin LEE

IPC: B65G47/90

CPC classification number: B65G47/904 ,  B65G47/905 ,  B66F7/02

Abstract: A tower lift includes a main frame, a first carriage module and a second carriage module connected with each other inside the main frame at left and right sides of the main frame, respectively, having the same weight as each other, and configured to be moved in a vertical direction, and a driving module installed on the main frame and configured to move the first carriage module and the second carriage module in the vertical direction.

公开(公告)号：US20230163009A1

公开(公告)日：2023-05-25

申请号：US17747914

申请日：2022-05-18

Applicant: SEMES CO., LTD.

Inventor： Sang Oh KIM ,  Myung Jin LEE

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/687 ,  B65G47/90

CPC classification number: H01L21/681 ,  H01L21/67742 ,  H01L21/68707 ,  B65G47/90

Abstract: The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus of the present disclosure comprises a process chamber having a treating space therein, a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate, and a teaching buffer for aligning the robot hand, wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate, wherein the transfer robot aligns the robot hand with the reference point using the camera.

公开(公告)号：US20240014059A1

公开(公告)日：2024-01-11

申请号：US18124329

申请日：2023-03-21

Applicant: SEMES CO., LTD.

Inventor： Chan Young CHOI ,  Sang Oh KIM ,  Wan Hee JEONG ,  Hee Jae BYUN

IPC: H01L21/677 ,  H01L21/687 ,  B25J19/00 ,  B25J11/00 ,  B25J5/02 ,  H02J50/12

CPC classification number: H01L21/67733 ,  H01L21/68707 ,  B25J19/0045 ,  B25J11/0095 ,  B25J5/02 ,  H02J50/12

Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.

公开(公告)号：US20240139967A1

公开(公告)日：2024-05-02

申请号：US18384639

申请日：2023-10-27

Applicant: SEMES CO., LTD.

Inventor： Sang Hyeop LEE ,  Ki Won HAN ,  Sang Oh KIM ,  Kyo Bong KIM ,  Hee Chan KIM

IPC: B25J11/00 ,  B25J9/16 ,  B25J13/08 ,  B25J15/00

CPC classification number: B25J11/0095 ,  B25J9/1682 ,  B25J13/088 ,  B25J15/0014

Abstract: A substrate transport robot capable of enhancing processing speed and avoiding interference with structures and a system including the substrate transport robot are provided. The substrate transport robot includes: one or more robot arms including transfer hands and transferring semiconductor substrates with the transfer hands; an arm driving module coupled to each of the robot arms and controlling the movement of each of the robot arms; and a horizontal/vertical movement module controlling the position movement of the arm driving module, wherein multiple robot arms are provided, and multiple transfer hands are included in each of the multiple robot arms.

公开(公告)号：US20240112938A1

公开(公告)日：2024-04-04

申请号：US18134489

申请日：2023-04-13

Applicant: SEMES CO., LTD.

Inventor： Hee Jae BYUN ,  Kyo Bong KIM ,  Chan Young CHOI ,  Wan Hee JEONG ,  Sang Oh KIM

IPC: H01L21/68 ,  B25J11/00 ,  B25J13/08 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J13/08 ,  H01L21/67259 ,  H01L21/68707

Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.