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1.
公开(公告)号:US20240014059A1
公开(公告)日:2024-01-11
申请号:US18124329
申请日:2023-03-21
Applicant: SEMES CO., LTD.
Inventor: Chan Young CHOI , Sang Oh KIM , Wan Hee JEONG , Hee Jae BYUN
IPC: H01L21/677 , H01L21/687 , B25J19/00 , B25J11/00 , B25J5/02 , H02J50/12
CPC classification number: H01L21/67733 , H01L21/68707 , B25J19/0045 , B25J11/0095 , B25J5/02 , H02J50/12
Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.
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公开(公告)号:US20230076551A1
公开(公告)日:2023-03-09
申请号:US17886823
申请日:2022-08-12
Applicant: SEMES CO., LTD.
Inventor: Na Hyun LEE , Sang-Oh KIM , Myung Jin LEE , Hee Jae BYUN
IPC: B65G47/90
Abstract: Provided is a tower lift, including: a body; a first carriage module and a second carriage module configured to be movable in a vertical direction along the body and each support objects to be transferred; a driving unit comprising a driving belt which vertically moves the first carriage module and the second carriage module and on which the first carriage module or the second carriage module is mounted; and a gap adjusting unit adjusting a gap between the first carriage module and the second carriage module.
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公开(公告)号:US20240203774A1
公开(公告)日:2024-06-20
申请号:US18536845
申请日:2023-12-12
Applicant: SEMES CO., LTD.
Inventor: Kyo Bong KIM , Ki Won HAN , Sang-Oh KIM , Hee Jae BYUN , Hee Chan KIM , Sang Hyeop LEE
IPC: H01L21/677 , B25J11/00 , B25J15/00 , H01L21/687
CPC classification number: H01L21/67742 , B25J11/0095 , B25J15/0014 , H01L21/68707
Abstract: The inventive concept provides a substrate transfer apparatus. The substrate transfer apparatus includes a base; a first transfer arm configured to have a first arm link connected to the base and a first end effector connected to the first arm link, and which operates between a contract position and an expand position; and a guide member aligning a substrate placed on the first end effector while the first transfer arm backwardly moves from the expand position to the contract position.
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公开(公告)号:US20230166925A1
公开(公告)日:2023-06-01
申请号:US17750359
申请日:2022-05-22
Applicant: SEMES CO., LTD.
Inventor: Hee Jae BYUN , Sang Oh KIM , Na Hyun LEE , Myung Jin LEE
IPC: B65G47/90
CPC classification number: B65G47/904 , B65G47/905 , B66F7/02
Abstract: A tower lift includes a main frame, a first carriage module and a second carriage module connected with each other inside the main frame at left and right sides of the main frame, respectively, having the same weight as each other, and configured to be moved in a vertical direction, and a driving module installed on the main frame and configured to move the first carriage module and the second carriage module in the vertical direction.
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5.
公开(公告)号:US20240112938A1
公开(公告)日:2024-04-04
申请号:US18134489
申请日:2023-04-13
Applicant: SEMES CO., LTD.
Inventor: Hee Jae BYUN , Kyo Bong KIM , Chan Young CHOI , Wan Hee JEONG , Sang Oh KIM
IPC: H01L21/68 , B25J11/00 , B25J13/08 , H01L21/67 , H01L21/687
CPC classification number: H01L21/681 , B25J11/0095 , B25J13/08 , H01L21/67259 , H01L21/68707
Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.
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6.
公开(公告)号:US20240063039A1
公开(公告)日:2024-02-22
申请号:US18135681
申请日:2023-04-17
Applicant: SEMES CO., LTD
Inventor: Hee Jae BYUN , Chang Rak Baek , Kyo Bong Kim , Chan Young Choi , Wan Hee Jeong , Ki Won Han , Sang Oh Kim
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67259 , H01L21/68707
Abstract: An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.
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公开(公告)号:US20230286778A1
公开(公告)日:2023-09-14
申请号:US17692539
申请日:2022-03-11
Applicant: SEMES CO., LTD.
Inventor: Myung Jin LEE , Sang-Oh KIM , Hee Jae BYUN , Na Hyun LEE
IPC: B66B5/18 , B66B5/22 , H01L21/687
CPC classification number: B66B5/18 , B66B5/22 , H01L21/68764
Abstract: The present invention provides a tower lift. The tower lift includes: a rail module extended in a vertical direction; and a carriage module provided to be movable by a magnetic levitation method along the rail module, in which in the carriage module, a braking unit which brakes falling of the carriage module when power driving the tower lift is cut is installed.
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