公开(公告)号：US20240416394A1

公开(公告)日：2024-12-19

申请号：US18799283

申请日：2024-08-09

Applicant: SEMES CO., LTD.

Inventor： Tae-Keun KIM ,  Kyeong Min LEE ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  H01L21/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

公开(公告)号：US20230405645A1

公开(公告)日：2023-12-21

申请号：US17826729

申请日：2022-05-27

Applicant: SEMES CO., LTD.

Inventor： Kyeong Min LEE ,  Tae-Keun KIM ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  B08B3/10

CPC classification number: B08B7/0014 ,  B08B3/10

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.

公开(公告)号：US20230364656A1

公开(公告)日：2023-11-16

申请号：US17740772

申请日：2022-05-10

Applicant: SEMES CO., LTD.

Inventor： Tae-Keun KIM ,  Kyeong Min LEE ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  H01L21/02

CPC classification number: B08B7/0014 ,  H01L21/02057

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

公开(公告)号：US20230207338A1

公开(公告)日：2023-06-29

申请号：US17978328

申请日：2022-11-01

Applicant: SEMES CO., LTD.

Inventor： Min Hee CHO ,  Kyeong Min LEE ,  Won Young KANG ,  Kang Sul KIM ,  Tae-Keun KIM

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/02052

Abstract: An exemplary embodiment of the present invention provides a substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate; and supplying a rinse liquid onto the substrate.