公开(公告)号：US20230405645A1

公开(公告)日：2023-12-21

申请号：US17826729

申请日：2022-05-27

Applicant: SEMES CO., LTD.

Inventor： Kyeong Min LEE ,  Tae-Keun KIM ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  B08B3/10

CPC classification number: B08B7/0014 ,  B08B3/10

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.

公开(公告)号：US20230171853A1

公开(公告)日：2023-06-01

申请号：US17865976

申请日：2022-07-15

Applicant: SEMES CO., LTD.

Inventor： Min Hee CHO ,  Won Young KANG ,  Jun Ho SONG

IPC: H05B3/00 ,  G01K13/02 ,  H05B3/40 ,  H05B3/03

CPC classification number: H05B3/0004 ,  G01K13/02 ,  H05B3/03 ,  H05B3/40

Abstract: A heating device capable of heating a processing liquid stably and efficiently is provided. The heating device comprises a first unit heater including a first flow path, a second unit heater including a second flow path, and a first tube connecting the first unit heater and the second unit heater, wherein a processing liquid flows through the first flow path, the first tube, and the second flow path, and is heated by the first unit heater and the second unit heater, wherein the first unit heater comprises a first pipe extending along a first direction and including the first flow path formed therein along the first direction, a first input terminal formed on a surface of the first pipe and extending in the first direction, a first output terminal formed on a surface of the first pipe, extending in the first direction, and spaced apart from the first input terminal, a plurality of first heating wires spaced apart from each other, formed on a surface of the first pipe, and connecting the first input terminal and the first output terminal.

公开(公告)号：US20230166302A1

公开(公告)日：2023-06-01

申请号：US18058570

申请日：2022-11-23

Applicant: SEMES CO., LTD.

Inventor： Jun Ho SONG ,  Min Hee CHO ,  Won Young KANG

IPC: B08B3/10 ,  B08B3/02 ,  B08B13/00 ,  B08B3/08 ,  B08B3/04 ,  F24H1/12 ,  H05B3/48

CPC classification number: B08B3/10 ,  B08B3/08 ,  B08B3/022 ,  B08B3/041 ,  B08B13/00 ,  F24H1/122 ,  H05B3/48 ,  B08B2203/007 ,  H01L21/67051

Abstract: Provided is a liquid supply unit for supplying a treatment liquid to a nozzle that discharges the treatment liquid to a substrate, the liquid supply unit including: a tank for storing the treatment liquid; a main circulation line for supplying the treatment liquid from an internal space of the tank to the nozzle or for recovering the treatment liquid to the internal space of the tank; a supply line connected to the main circulation line to supply the treatment liquid to the nozzle; and a heater module installed in the main circulation line and heating the treatment liquid flowing through the main circulation line to a predetermined temperature, in which the heater module includes: a pipe in which the treatment liquid flows and which is made of a quartz material; and a heating element provided on a surface of the pipe.

公开(公告)号：US20240416394A1

公开(公告)日：2024-12-19

申请号：US18799283

申请日：2024-08-09

Applicant: SEMES CO., LTD.

Inventor： Tae-Keun KIM ,  Kyeong Min LEE ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  H01L21/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

公开(公告)号：US20230215740A1

公开(公告)日：2023-07-06

申请号：US17843919

申请日：2022-06-17

Applicant: SEMES CO., LTD.

Inventor： Won Young KANG ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Min Hee CHO

IPC: H01L21/67 ,  B08B3/10 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/10 ,  H01L21/68764 ,  H01L21/02057

Abstract: There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.

公开(公告)号：US20230364656A1

公开(公告)日：2023-11-16

申请号：US17740772

申请日：2022-05-10

Applicant: SEMES CO., LTD.

Inventor： Tae-Keun KIM ,  Kyeong Min LEE ,  Min Hee CHO ,  Won Young KANG

IPC: B08B7/00 ,  H01L21/02

CPC classification number: B08B7/0014 ,  H01L21/02057

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes discharging a treating liquid including a polymer and a solvent onto a substrate; and solidifying a liquid film of the treating liquid by volatilizing the solvent from the treating liquid on the substrate, and wherein the solidifying a liquid film comprises a first period of stopping the rotation of the substrate or rotating the substrate at a first speed for a first time period.

公开(公告)号：US20230207338A1

公开(公告)日：2023-06-29

申请号：US17978328

申请日：2022-11-01

Applicant: SEMES CO., LTD.

Inventor： Min Hee CHO ,  Kyeong Min LEE ,  Won Young KANG ,  Kang Sul KIM ,  Tae-Keun KIM

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/02052

Abstract: An exemplary embodiment of the present invention provides a substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate; and supplying a rinse liquid onto the substrate.

公开(公告)号：US20230170229A1

公开(公告)日：2023-06-01

申请号：US17879785

申请日：2022-08-03

Applicant: SEMES CO, LTD.

Inventor： Kyeong Min LEE ,  Tae Keun KIM ,  Kang Sul KIM ,  Min Hee CHO ,  Won Young KANG

IPC: H01L21/67 ,  C23C14/58 ,  C23C14/50

CPC classification number: H01L21/67051 ,  C23C14/5873 ,  C23C14/505

Abstract: Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.