公开(公告)号：US20160190095A1

公开(公告)日：2016-06-30

申请号：US15063011

申请日：2016-03-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Phillip CELAYA ,  James P. LETTERMAN, JR. ,  Robert L. MARGUIS ,  Darrell TRUHITTE

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L21/02021 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/29099

Abstract: Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The method may also include coating the two or more leads of the leadframe with an electrically conductive layer. The method may include fully electrically and physically singulating one or more tie bars between two or more leads of the leadframe, a lead of the two or more leads and a leadframe flag, or any combination thereof. The method may also include singulating the leadframe to form one or more semiconductor packages.

Abstract translation: 形成半导体封装的方法。 实现包括提供引线框架，将半导体管芯或电子部件耦合到引线框架，以及使用模制化合物封装半导体管芯或电子部件的至少一部分，从而使引线框架的两个或多个引线暴露。 该方法还可以包括用导电层涂覆引线框架的两个或多个引线。 该方法可以包括完全电和物理地分离引线框架的两个或更多个引线之间的一个或多个连接杆，两个或多个引线的引线和引线框标志，或其任何组合。 该方法还可以包括分离引线框以形成一个或多个半导体封装。

公开(公告)号：US20250022831A1

公开(公告)日：2025-01-16

申请号：US18625487

申请日：2024-04-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Nam Khong THEN ,  Hui Min LER ,  Phillip CELAYA ,  Chee Hiong CHEW

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/495 ,  H01L25/065

Abstract: Implementations of a leadframe for a semiconductor package may include a half-etched gate lead directly coupled to a gate tie bar; a half-etched source lead directly coupled to a source tie bar; and a die flag directly coupled to at least two die flag tie bars. The gate tie bar and the source tie bar may be configured to enable electroplating of a flank of the half-etched gate lead and the half-etched source lead.

公开(公告)号：US20200312749A1

公开(公告)日：2020-10-01

申请号：US16903706

申请日：2020-06-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Swee Har KHOR ,  Tian Hing LIM ,  Hui Min LER ,  Chee Hiong CHEW ,  Phillip CELAYA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/60

Abstract: In one embodiment, methods for making semiconductor devices are disclosed.

公开(公告)号：US20180138144A1

公开(公告)日：2018-05-17

申请号：US15870215

申请日：2018-01-12

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Phillip CELAYA ,  James P. LETTERMAN, JR. ,  Robert L. MARQUIS ,  Darrell TRUHITTE

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/02 ,  H01L23/31

CPC classification number: H01L24/97 ,  H01L21/02021 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/29099

Abstract: Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The method may also include coating the two or more leads of the leadframe with an electrically conductive layer. The method may include fully electrically and physically singulating one or more tie bars between two or more leads of the leadframe, a lead of the two or more leads and a leadframe flag, or any combination thereof. The method may also include singulating the leadframe to form one or more semiconductor packages.

公开(公告)号：US20190244928A1

公开(公告)日：2019-08-08

申请号：US16387958

申请日：2019-04-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Phillip CELAYA ,  James P. LETTERMAN, JR. ,  Robert L. MARQUIS ,  Darrell TRUHITTE

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48 ,  H01L21/02

CPC classification number: H01L24/97 ,  H01L21/02021 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/29099

Abstract: Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The method may also include coating the two or more leads of the leadframe with an electrically conductive layer. The method may include fully electrically and physically singulating one or more tie bars between two or more leads of the leadframe, a lead of the two or more leads and a leadframe flag, or any combination thereof. The method may also include singulating the leadframe to form one or more semiconductor packages.

公开(公告)号：US20180090421A1

公开(公告)日：2018-03-29

申请号：US15278203

申请日：2016-09-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Nam Khong THEN ,  Hui Min LER ,  Phillip CELAYA ,  Chee Hiong CHEW

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L21/4853 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/73221

Abstract: A method for plating package leads, in some embodiments, comprises: providing a package having a lead electrically coupled to a tie bar; singulating said lead; electroplating said singulated lead using the tie bar; and singulating said tie bar.

公开(公告)号：US20170062310A1

公开(公告)日：2017-03-02

申请号：US14842571

申请日：2015-09-01

Applicant: Semiconductor Components Industries, LLC

Inventor： Swee Har KHOR ,  Tian Hing LIM ,  Hui Min LER ,  Chee Hiong CHEW ,  Phillip CELAYA

IPC: H01L23/495 ,  H01L23/00

Abstract: In one embodiment, methods for making semiconductor devices are disclosed.

Abstract translation: 在一个实施例中，公开了制造半导体器件的方法。