公开(公告)号：US20190013290A1

公开(公告)日：2019-01-10

申请号：US16131401

申请日：2018-09-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Wentao QIN ,  Gordon M. GRIVNA ,  Harold ANDERSON ,  Thomas ANDERSON ,  George CHANG

IPC: H01L23/00

Abstract: A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

公开(公告)号：US20160307865A1

公开(公告)日：2016-10-20

申请号：US15091436

申请日：2016-04-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Wentao QIN ,  Gordon M. GRIVNA ,  Harold ANDERSON ,  Thomas ANDERSON ,  George CHANG

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45647 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2924/00 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45664 ,  H01L2224/45655 ,  H01L2224/45611 ,  H01L2224/45693 ,  H01L2224/45686 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01014 ,  H01L2924/00013 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01092 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206

Abstract: A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

Abstract translation: 线接系统。 实施方案可以包括：包括铜（Cu），包括铝（Al）的接合焊盘和与焊盘电耦合的牺牲阳极的接合线，其中牺牲阳极包括一个或多个元件，标准电极电位低于标准电极 铝的潜力