公开(公告)号：US20160307865A1

公开(公告)日：2016-10-20

申请号：US15091436

申请日：2016-04-05

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Wentao QIN ,  Gordon M. GRIVNA ,  Harold ANDERSON ,  Thomas ANDERSON ,  George CHANG

IPC分类号： H01L23/00

CPC分类号： H01L24/45 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45647 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2924/00 ,  H01L2224/45644 ,  H01L2224/45639 ,  H01L2224/45664 ,  H01L2224/45655 ,  H01L2224/45611 ,  H01L2224/45693 ,  H01L2224/45686 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01014 ,  H01L2924/00013 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01092 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206

摘要： A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

摘要翻译： 线接系统。 实施方案可以包括：包括铜（Cu），包括铝（Al）的接合焊盘和与焊盘电耦合的牺牲阳极的接合线，其中牺牲阳极包括一个或多个元件，标准电极电位低于标准电极 铝的潜力

公开(公告)号：US6140583A

公开(公告)日：2000-10-31

申请号：US864339

申请日：1997-05-28

申请人： Satoshi Suzuki ,  Morimasa Tanimoto

发明人： Satoshi Suzuki ,  Morimasa Tanimoto

IPC分类号： C23C28/02 ,  H01L21/60 ,  H01L23/48 ,  H01L23/49 ,  H01L23/50 ,  H05K1/00

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45611 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/4851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19043

摘要： A lead member for electronic parts which has excellent heat resistance, oxidation resistance and corrosion resistance and is especially excellent in solderability and a process of producing such a lead member at low cost by plating are provided. The lead member comprises a base, at least a surface region of which is made of Cu or a Cu alloy, a primary coat of Ni, Co, a Ni alloy or a Co alloy and a surface layer of Pd, Ru, a Pd alloy or a Ru alloy formed sequentially on the base in the order mentioned. The primary coat consists of grains having a grain size of 20 .mu.m or more.

摘要翻译： 提供了具有优异的耐热性，抗氧化性和耐腐蚀性并且特别优异的可焊性的电子部件的引线部件和通过电镀以低成本制造这种引线部件的工艺。 引线构件包括基底，至少其表面区域由Cu或Cu合金制成，Ni，Co，Ni合金或Co合金的初级涂层以及Pd，Ru，Pd合金的表面层 或Ru合金按照所述顺序依次形成在基材上。 初级涂层由粒径20μm以上的晶粒构成。

公开(公告)号：US5045410A

公开(公告)日：1991-09-03

申请号：US375968

申请日：1989-07-03

申请人： Heinz G. Hiesbock ,  Karl Bartl

发明人： Heinz G. Hiesbock ,  Karl Bartl

IPC分类号： B23K35/02 ,  B23K35/14 ,  B32B15/01

CPC分类号： H01L24/45 ,  B23K35/0222 ,  B32B15/01 ,  H01L2224/45012 ,  H01L2224/45111 ,  H01L2224/45147 ,  H01L2224/45163 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45655 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  Y10S428/929 ,  Y10T428/12694 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

摘要： A band-shaped and/or filamentary material, having a phosphorus containing metal and/or metal alloy inner layer such as phosphor bronze, deoxidized copper or other similar phosphorus containing material, and a lead alloy outer layer, particularly a lead-tin alloy, wherein the phosphorus content of the inner layer is between 0.03 and 0.13 weight percent. In the preferred embodiment, the amount of phosphorus in the inner layer is between 0.05 and 0.06 weight percent. Electrical conductors and electronic components of this band-shaped and/or filamentary material are also disclosed.

摘要翻译： 具有含磷金属和/或金属合金内层如磷青铜，脱氧铜或其它类似含磷材料的带状和/或丝状材料，以及铅合金外层，特别是铅锡合金， 其中内层的磷含量在0.03至0.13重量％之间。 在优选实施方案中，内层中的磷的量为0.05至0.06重量％。 还公开了该带状和/或丝状材料的电导体和电子部件。

公开(公告)号：US08692118B2

公开(公告)日：2014-04-08

申请号：US13168675

申请日：2011-06-24

申请人： Cyprian Uzoh ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Craig Mitchell

IPC分类号： H01B5/00

CPC分类号： H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

摘要： A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

摘要翻译： 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US20130042949A1

公开(公告)日：2013-02-21

申请号：US13571781

申请日：2012-08-10

申请人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

发明人： Hideyuki Sagawa ,  Seigi Aoyama ,  Hiromitsu Kuroda ,  Toru Sumi ,  Keisuke Fujito ,  Ryohei Okada ,  Shinichi Masui

IPC分类号： C22F1/08 ,  B21D31/00

CPC分类号： C22F1/08 ,  B21C1/003 ,  C22C9/00 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01012 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01016 ,  H01L2924/01008 ,  H01L2924/01205

摘要： A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.

摘要翻译： 软 - 稀铜合金材料的制造方法包括：软 - 稀铜合金的塑性加工，其包含选自Ti，Mg，Zr，Nb，Ca，V，Ni， Mn和Cr，余量由铜和不可避免的杂质组成，以及随后的软 - 稀铜铜合金的退火处理。 退火处理前塑料加工的加工率不小于50％。

公开(公告)号：US20110107595A1

公开(公告)日：2011-05-12

申请号：US13008928

申请日：2011-01-19

申请人： Manfred Schneegans ,  Markus Leicht ,  Stefan Woehlert ,  Edmund Riedl

发明人： Manfred Schneegans ,  Markus Leicht ,  Stefan Woehlert ,  Edmund Riedl

IPC分类号： H01L21/58

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05611 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48611 ,  H01L2224/48711 ,  H01L2224/48799 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85815 ,  H01L2224/85825 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19042 ,  H01L2924/20751 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2924/013 ,  H01L2924/01006

摘要： A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a copper electrical connector between the contact pins and the contact pad, and diffusion soldering the copper electrical connector to the active area with a solder material including tin to form a solder connection including a contiguous bronze coating disposed between and in direct contact with both the copper electrical connector and the contact pad.

摘要翻译： 一种将半导体芯片电连接到另一个电子设备的方法，包括提供包括接触引脚和附接到载体的芯片的载体，所述芯片具有背离载体的铜接触焊盘，在接触引脚之间延伸铜电连接器 以及接触焊盘，并且使用包括锡的焊料材料将铜电连接器扩散焊接到有源区域，以形成包括布置在铜电连接器和接触焊盘两者之间并且与铜电连接器和接触焊盘两者直接接触的连续青铜镀层的焊料连接。

公开(公告)号：US20070235887A1

公开(公告)日：2007-10-11

申请号：US10550548

申请日：2004-10-13

申请人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

发明人： Shingo Kaimori ,  Tsuyoshi Nonaka ,  Masanori Ioka

IPC分类号： H01L23/52 ,  H01B5/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/45683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48639 ,  H01L2224/48839 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01204 ,  H01L2924/01206 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01008 ,  H01L2924/01016 ,  H01L2924/01001 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00015 ,  H01L2924/01076 ,  H01L2924/01006

摘要： A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/μm2 but not greater than 0.165 mN/μm2; or 4. the Vickers hardness of the coating layer is 300 or lower.

摘要翻译： 一种接合线，其包括芯和形成在所述芯上的涂层，其中所述涂层由具有比所述芯更高的熔点的金属形成，并且还具有以下特征中的至少一个; 当芯熔化时与涂层的湿接触角不小于20度; 2.当接合线悬挂时，其端部接触水平表面，并在端部上方15厘米处切割，因此落在水平面上，所形成的弧的曲率半径为35毫米或更大; 0.2％的屈服强度不小于0.115mN / m 2，但不大于0.165mN / m 2。 或4.涂层的维氏硬度为300以下。

公开(公告)号：US07032311B2

公开(公告)日：2006-04-25

申请号：US10179560

申请日：2002-06-25

申请人： Eli Razon

发明人： Eli Razon

IPC分类号： H01B19/00

CPC分类号： H01L24/85 ,  H01L21/4825 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01R13/2407 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10719 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.

公开(公告)号：US3443914A

公开(公告)日：1969-05-13

申请号：US3443914D

申请日：1966-07-25

申请人： NIPPON ELECTRIC CO

发明人： HAYASHI KAZUTAMI

IPC分类号： B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  C03C27/04 ,  H01L23/492 ,  H01L23/495 ,  B32B17/06 ,  H01J5/26

CPC分类号： H01L23/49582 ,  B23K35/004 ,  B23K35/0238 ,  B23K35/0272 ,  B23K35/30 ,  C03C27/046 ,  H01L23/4924 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/48247 ,  H01L2224/48664 ,  H01L2224/85464 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  Y10S428/926 ,  Y10T428/12722 ,  Y10T428/12875 ,  Y10T428/12882 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/00013

摘要： 1,147,522. Glass to metal seals. NIPPON ELECTRIC CO. Ltd. 14 July, 1966 [31 July, 1965], No. 31737/66. Heading C1M. [Also in Divisions B3 and C7] A composite metal material to be sealed to glass comprises an iron-nickel or iron core, an intermediate coating of Sn, Cu, Ag or Au of 0À01 to 5 microns and a surface coating of Pd of 0À01 to 2 microns. The material may be heated to e.g. 750‹ C. in hydrogen. In examples an iron-nickel alloy coated with copper, silver or gold and then palladium was heated, treated in hydrogen and then sealed in air to a lead glass PbO 75; B 2 O 11; SiO 2 3; Al 2 O 3 11 in wt. percentages. Iron wire coated with silver and Pd was similarly heat treated in H 2 and sealed to a glass appropriate to an iron seal.

公开(公告)号：US12033972B2

公开(公告)日：2024-07-09

申请号：US17090941

申请日：2020-11-06

申请人： Infineon Technologies AG

发明人： Joachim Mahler ,  Michael Bauer ,  Jochen Dangelmaier ,  Reimund Engl ,  Johann Gatterbauer ,  Frank Hille ,  Michael Huettinger ,  Werner Kanert ,  Heinrich Koerner ,  Brigitte Ruehle ,  Francisco Javier Santos Rodriguez ,  Antonio Vellei

IPC分类号： H01L23/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02288 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/83 ,  H01L24/85 ,  H01L21/02266 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/0228 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0346 ,  H01L2224/03826 ,  H01L2224/03827 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45649 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/4567 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48507 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/45144 ,  H01L2924/00015 ,  H01L2224/45139 ,  H01L2924/00015 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45572 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/45644 ,  H01L2224/45147 ,  H01L2924/01046 ,  H01L2224/45639 ,  H01L2924/00014 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2924/00014 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45669 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45644 ,  H01L2224/45565 ,  H01L2224/45139 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45611 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45618 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45649 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45655 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45657 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45666 ,  H01L2224/45655 ,  H01L2924/01029 ,  H01L2224/45565 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/45664 ,  H01L2924/01028 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05681 ,  H01L2924/00014 ,  H01L2224/05657 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/01056 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/43848

摘要： A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.