DISPLAY DEVICE
    1.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号:US20130341627A1

    公开(公告)日:2013-12-26

    申请号:US13971144

    申请日:2013-08-20

    Abstract: The invention provides an active matrix EL display device which can perform a clear multi-gray scale color display. In particular, the invention provides a large active matrix EL display device at low cost by a manufacturing method which can selectively form a pattern. Power supply lines in a pixel portion are arranged in matrix by the manufacturing method which can selectively form a pattern. Further, capacitance between wirings is reduced by providing a longer distance between adjacent wirings by the manufacturing method which can selectively form a pattern.

    Abstract translation: 本发明提供一种能够执行清晰的多灰阶彩色显示的有源矩阵EL显示装置。 特别地,本发明通过可以选择性地形成图案的制造方法以低成本提供大的有源矩阵EL显示装置。 通过可以选择性地形成图案的制造方法将像素部分中的电源线布置成矩阵。 此外,通过可以选择性地形成图案的制造方法,通过在相邻布线之间提供更长的距离来减小布线之间的电容。

    LAMINATING SYSTEM, IC SHEET, SCROLL OF IC SHEET, AND METHOD FOR MANUFACTURING IC CHIP
    4.
    发明申请
    LAMINATING SYSTEM, IC SHEET, SCROLL OF IC SHEET, AND METHOD FOR MANUFACTURING IC CHIP 审中-公开
    层压系统,集成电路板,电路板的滚动及制造IC芯片的方法

    公开(公告)号:US20150287660A1

    公开(公告)日:2015-10-08

    申请号:US14724152

    申请日:2015-05-28

    Abstract: Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member.

    Abstract translation: 薄膜集成电路从基板剥离,并且剥离的薄膜集成电路被有效地密封以提高制造成品率。 本发明提供了一种层叠体系,其包括用于输送设置有多个薄膜集成电路的基板的输送机构; 第一剥离装置,用于将薄膜集成电路的第一表面接合到第一片状部件,以从基板剥离薄膜集成电路; 第二剥离装置,用于将薄膜集成电路的第二表面接合到第二片状部件,以将薄膜集成电路从第一片状部件剥离; 以及密封装置,用于将所述薄膜集成电路插入所述第二片状部件和第三片状部件之间,以与所述第二片状部件和所述第三片状部件密封所述薄膜集成电路。

    LAMINATION SYSTEM, IC SHEET, SCROLL OF IC SHEET, AND METHOD FOR MANUFACTURING IC CHIP

    公开(公告)号:US20190147312A1

    公开(公告)日:2019-05-16

    申请号:US16248349

    申请日:2019-01-15

    Abstract: Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member.

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