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公开(公告)号：US11997859B2
公开(公告)日：2024-05-28
申请号：US17941148
申请日：2022-09-09
IPC分类号： H01L51/50 , H01L27/12 , H10K50/11 , H10K59/121 , H10K59/126 , H10K59/131 , H10K77/10 , H01L29/786
CPC分类号： H10K50/11 , H01L27/12 , H01L27/1225 , H10K59/1213 , H10K59/126 , H10K59/131 , H10K77/111 , H01L27/124 , H01L29/78678 , H01L29/7869
摘要： An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.
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公开(公告)号：US11830391B2
公开(公告)日：2023-11-28
申请号：US17312487
申请日：2019-12-06
发明人： Shingo Eguchi , Taiki Nonaka , Daiki Nakamura , Nozomu Sugisawa , Kazuhiko Fujita , Shunpei Yamazaki
CPC分类号： G09F9/30 , G06F1/1607 , H05K5/0017 , H05K5/0226 , H10K59/12 , H10K77/111
摘要： A novel display panel that is highly convenient, useful, or reliable is provided. The display panel includes a display region, a first support, and a second support, the display region includes a first region, a second region, and a third region, the first region and the second region each have a belt-like shape extending in one direction, and the third region is sandwiched between the first region and the second region. The first support overlaps with the first region and is less likely to be warped than the third region, and the second support overlaps with the second region and is less likely to be warped than the third region. The second support can pivot on an axis extending in the one direction with respect to the first support.
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公开(公告)号：US11557697B2
公开(公告)日：2023-01-17
申请号：US17405547
申请日：2021-08-18
发明人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada , Satoshi Seo
摘要： An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
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公开(公告)号：US11355382B2
公开(公告)日：2022-06-07
申请号：US16850185
申请日：2020-04-16
发明人： Seiji Yasumoto , Masataka Sato , Shingo Eguchi , Kunihiko Suzuki
IPC分类号： H01L21/683 , H01L21/67 , H01L51/00 , H01L29/786 , B32B38/10 , H01L51/50
摘要： To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
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公开(公告)号：US11171298B2
公开(公告)日：2021-11-09
申请号：US16458575
申请日：2019-07-01
摘要： An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.
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公开(公告)号：US11127732B2
公开(公告)日：2021-09-21
申请号：US16028992
申请日：2018-07-06
发明人： Yoshiaki Oikawa , Shingo Eguchi
摘要： To solve a problem in that an antenna or a circuit including a thin film transistor is damaged due to discharge of electric charge accumulated in an insulator (a problem of electrostatic discharge), a semiconductor device includes a first insulator, a circuit including a thin film transistor provided over the first insulator, an antenna which is provided over the circuit and is electrically connected to the circuit, and a second insulator provided over the antenna, a first conductive film provided between the first insulator and the circuit, and a second conductive film provided between the second insulator and the antenna.
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公开(公告)号：US10442172B2
公开(公告)日：2019-10-15
申请号：US15610890
申请日：2017-06-01
发明人： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
IPC分类号： B32B43/00 , G02B6/00 , H01L21/67 , B26D1/04 , H01L51/56 , B32B38/10 , B26D1/00 , H01L27/12 , H01L27/32
摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
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公开(公告)号：US10114450B2
公开(公告)日：2018-10-30
申请号：US15238888
申请日：2016-08-17
发明人： Shingo Eguchi
IPC分类号： G06F3/01 , G09G3/20 , G02F1/1335
摘要： A novel information processing device that is highly convenient or reliable is provided. For example, a configuration including a selection circuit which has a function of selecting image information or background information on the basis of sensing information on the illuminance of an environment in which the information processing device is used and a photograph or a moving image included in the image information and supplying the selected information to a reflective display element or a light-emitting element has been devised.
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公开(公告)号：US20180294437A1
公开(公告)日：2018-10-11
申请号：US16006281
申请日：2018-06-12
发明人： Shunpei Yamazaki , Shingo Eguchi
CPC分类号： H01L51/5256 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3276 , H01L51/0097 , H01L51/5237 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L2251/5338 , H01L2251/558
摘要： A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
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公开(公告)号：US10065808B2
公开(公告)日：2018-09-04
申请号：US15219930
申请日：2016-07-26
发明人： Masakatsu Ohno , Kohei Yokoyama , Satoru Idojiri , Hisao Ikeda , Yasuhiro Jinbo , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi
IPC分类号： B32B38/10 , B65G49/06 , H01L51/52 , H01L51/56 , B32B17/06 , B32B37/00 , B32B43/00 , B65H3/08 , B65H3/48 , B65H16/00 , B65H35/00 , H01L27/32 , H01L21/68 , H01L21/673 , H01L21/677
摘要： An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
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