公开(公告)号：US20230260823A1

公开(公告)日：2023-08-17

申请号：US18025577

申请日：2021-10-12

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Ulrich Tschinderle

IPC: H01L21/687

CPC classification number: H01L21/68721 ,  H01L21/68707 ,  H01L21/68728

Abstract: The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket. At least a portion of the actuation unit is moveable relative to the clipping bracket to move the first arm in the receiving position or the fastening position.

公开(公告)号：US20240141535A1

公开(公告)日：2024-05-02

申请号：US18569066

申请日：2021-12-10

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Ulrich Tschinderle

IPC: C25D5/08 ,  C25D21/10

CPC classification number: C25D5/08 ,  C25D21/10

Abstract: The present invention relates to a system of at least two distribution body elements for a chemical and/or electric surface treatment of a substrate, a modular distribution body comprising such a system and a manufacturing method for at least two distribution body elements.
In the system of at least two distribution body elements, each distribution body element has a plate shape and comprises jet openings for distributing a process fluid from inside the distribution body element to the substrate to be treated and drain openings for distributing the process fluid and an electric current through the distribution body element. Each distribution body element has a connecting area configured to be connected to a connecting area of another distribution body element to form a modular distribution body comprising at least two distribution body elements.

公开(公告)号：US20240213066A1

公开(公告)日：2024-06-27

申请号：US18287996

申请日：2022-02-16

Applicant: SEMSYSCO GMBH

Inventor： Ulrich Tschinderle ,  Herbert Ötzlinger ,  Louis Wagner

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/6734 ,  H01L21/6715 ,  H01L21/67379 ,  H01L21/67736 ,  H01L21/68728

Abstract: The present invention relates to a frame system. The frame system is configured for holding a substrate during a chemical and/or electrolytic surface treatment of the substrate. The frame system comprises a frame element and several finger units arranged at the frame element. The frame element is configured to at least partially surround lateral edges of the substrate and to spare at least a first surface or a second surface of the substrate to be accessible for the surface treatment. Each finger unit comprises a first finger and a second finger. The first finger is configured to contact the first surface of the substrate and the second finger is configured to contact the second surface of the substrate opposite to the first surface of the substrate. The first finger is movable relative to the frame element to clamp the substrate between the first finger and the second finger.

公开(公告)号：US20230265577A1

公开(公告)日：2023-08-24

申请号：US18015941

申请日：2021-05-03

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Ulrich Tschinderle

IPC: C25D17/06

CPC classification number: C25D17/06

Abstract: The disclosure relates to a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate and a method for assembling a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate. The plating frame unit comprises a front plate, a back plate, and a vacuum unit. The front plate comprises a front frame portion surrounding a front recess portion. The back plate comprises a back frame portion. The front frame portion and the back frame portion are connected to each other to hold the substrate between them. The vacuum unit is configured to reduce an inner pressure between the front frame portion and the back frame portion below a surrounding pressure to attach the front frame portion relative to the back frame portion.

公开(公告)号：US11942356B2

公开(公告)日：2024-03-26

申请号：US18025577

申请日：2021-10-12

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Ulrich Tschinderle

IPC: H01L21/687

CPC classification number: H01L21/68721 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68742

Abstract: The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket. At least a portion of the actuation unit is moveable relative to the clipping bracket to move the first arm in the receiving position or the fastening position.