中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

24 records (took 0.011 seconds)

    SYSTEM AND METHOD FOR A SURFACE TREATMENT OF A SUBSTRATE WITH A LIQUID
    1.
    发明公开
    SYSTEM AND METHOD FOR A SURFACE TREATMENT OF A SUBSTRATE WITH A LIQUID 审中-公开

    公开(公告)号：US20240145231A1

    公开(公告)日：2024-05-02

    申请号：US18574640

    申请日：2022-04-07

    Applicant: SEMSYSCO GMBH

    Inventor： Georg Hofer ,  Andreas Gleissner

    IPC: H01L21/02 ,  B08B3/04 ,  H01L21/67 ,  H01L21/683

    CPC classification number: H01L21/02087 ,  B08B3/041 ,  H01L21/67051 ,  H01L21/6838

    Abstract: The disclosure relates to a system for a surface treatment of a substrate with a liquid, comprising: a first substrate holder, a second substrate holder, a liquid dispensing unit, a treatment chamber, and control unit, wherein the first substrate holder is configured to hold the substrate, wherein the first substrate holder is moveable in the treatment chamber and configured to hand the substrate over to the second substrate holder, wherein the second substrate holder is rotatable and configured to hold the substrate during a rotation of the substrate in and relative to the treatment chamber, wherein the liquid dispensing unit is moveable relative to the second substrate holder and configured to dispense the liquid onto the substrate, and wherein the control unit is configured to control a rotational speed of the substrate, a position of the liquid dispensing unit and/or a dispense rate of the liquid. Further, the disclosure also relates to a method for a surface treatment of a substrate with a liquid, and to a computer program element for a system for a surface treatment of a substrate with a liquid.

    CLIPPING MECHANISM FOR FASTENING A SUBSTRATE FOR A SURFACE TREATMENT OF THE SUBSTRATE
    2.
    发明公开
    CLIPPING MECHANISM FOR FASTENING A SUBSTRATE FOR A SURFACE TREATMENT OF THE SUBSTRATE 审中-公开

    公开(公告)号：US20230260823A1

    公开(公告)日：2023-08-17

    申请号：US18025577

    申请日：2021-10-12

    Applicant: SEMSYSCO GMBH

    Inventor： Andreas Gleissner ,  Ulrich Tschinderle

    IPC: H01L21/687

    CPC classification number: H01L21/68721 ,  H01L21/68707 ,  H01L21/68728

    Abstract: The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket. At least a portion of the actuation unit is moveable relative to the clipping bracket to move the first arm in the receiving position or the fastening position.

    DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE
    3.
    发明公开
    DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE 审中-公开

    公开(公告)号：US20240011180A1

    公开(公告)日：2024-01-11

    申请号：US18038495

    申请日：2021-11-11

    Applicant: SEMSYSCO GMBH

    Inventor： Andreas Gleissner ,  Herbert Ötzlinger

    IPC: C25D17/00 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12

    CPC classification number: C25D17/007 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12

    Abstract: The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100).

    Substrate holding and locking system for chemical and/or electrolytic surface treatment
    6.
    发明授权
    Substrate holding and locking system for chemical and/or electrolytic surface treatment 有权

    公开(公告)号：US11965263B2

    公开(公告)日：2024-04-23

    申请号：US17794517

    申请日：2020-09-02

    Applicant: SEMSYSCO GMBH

    Inventor： Herbert Ötzlinger ,  Oliver Knoll ,  Raoul Schröder ,  Markus Gersdorff ,  Thomas Wirnsberger ,  Georg Hofer ,  Andreas Gleissner

    IPC: C25D17/06 ,  C25D17/00

    CPC classification number: C25D17/06 ,  C25D17/004

    Abstract: The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.

    PLATING FRAME UNIT FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF THE SUBSTRATE
    7.
    发明公开
    PLATING FRAME UNIT FOR HOLDING A SUBSTRATE IN A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF THE SUBSTRATE 审中-公开

    公开(公告)号：US20230265577A1

    公开(公告)日：2023-08-24

    申请号：US18015941

    申请日：2021-05-03

    Applicant: SEMSYSCO GMBH

    Inventor： Andreas Gleissner ,  Ulrich Tschinderle

    IPC: C25D17/06

    CPC classification number: C25D17/06

    Abstract: The disclosure relates to a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate and a method for assembling a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate. The plating frame unit comprises a front plate, a back plate, and a vacuum unit. The front plate comprises a front frame portion surrounding a front recess portion. The back plate comprises a back frame portion. The front frame portion and the back frame portion are connected to each other to hold the substrate between them. The vacuum unit is configured to reduce an inner pressure between the front frame portion and the back frame portion below a surrounding pressure to attach the front frame portion relative to the back frame portion.

    Distribution System for a Process Fluid for a Chemical and/or Electrolytic Surface Treatment of a Substrate
    8.
    发明公开
    Distribution System for a Process Fluid for a Chemical and/or Electrolytic Surface Treatment of a Substrate 审中-公开

    公开(公告)号：US20230250547A1

    公开(公告)日：2023-08-10

    申请号：US18013486

    申请日：2021-07-07

    Applicant: SEMSYSCO GMBH

    Inventor： Andreas Gleissner ,  Marianne Kolitsch-Mataln

    IPC: C25D17/00 ,  C25D5/08

    CPC classification number: C25D17/008 ,  C25D5/08

    Abstract: The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate and a manufacturing method for a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate. The distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate comprises a distribution body and a distribution medium. The distribution body comprises several openings for a process fluid and/or an electric current. The distribution medium covers at least some of the openings of the distribution body. The distribution medium comprises a netted framework with passages to distribute the process fluid and/or the electric current from the distribution body.

Patent Agency Ranking