公开(公告)号：US20240282803A1

公开(公告)日：2024-08-22

申请号：US18600228

申请日：2024-03-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62

Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.

公开(公告)号：US20230081487A1

公开(公告)日：2023-03-16

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20250062295A1

公开(公告)日：2025-02-20

申请号：US18936534

申请日：2024-11-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Kyu JANG ,  Yong Woo RYU ,  Seom Geun LEE ,  Cha E KIM

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L33/00 ,  H01L33/32 ,  H01L33/38 ,  H01L33/46

Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.

公开(公告)号：US20230387085A1

公开(公告)日：2023-11-30

申请号：US18231614

申请日：2023-08-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L24/16 ,  H01L2224/16505 ,  H01L2224/16227

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20220336428A1

公开(公告)日：2022-10-20

申请号：US17722369

申请日：2022-04-17

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Seong Kyu JANG ,  Yong Woo RYU ,  Seom Geun LEE ,  Cha E KIM

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46 ,  H01L33/38

Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.

公开(公告)号：US20180153007A1

公开(公告)日：2018-05-31

申请号：US15579370

申请日：2016-05-18

Applicant: Seoul Viosys Co., Ltd

Inventor： Mae Yi KIM ,  Seom Geun LEE ,  Yeo Jin YOON ,  Jin Woong LEE ,  Yong Woo RYU

IPC: H05B33/08 ,  H01L33/14 ,  H01L33/36

CPC classification number: H05B33/0803 ,  H01L33/14 ,  H01L33/36 ,  H01L33/382

Abstract: A light emitting diode including a first semiconductor layer and a plurality of mesas including a second semiconductor layer and an active layer interposed between the first semiconductor layer and the second semiconductor layer, the first semiconductor layer including an exposed region between the plurality of mesas, a current blocking layer disposed on a portion of the plurality of mesas and a portion of the exposed region, a transparent electrode layer covering the second semiconductor layer and the current blocking layer, and a second electrode disposed on the current blocking layer and the transparent electrode layer and electrically connected to the second semiconductor layer. The current blocking layer includes a connecting portion extending from a first mesa to a second mesa adjacent to the first mesa and a protruding portion protruding from the connecting portion and disposed on the exposed region.

公开(公告)号：US20240313182A1

公开(公告)日：2024-09-19

申请号：US18663570

申请日：2024-05-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L25/0756 ,  H01L27/156

Abstract: A stacked light emitting device includes a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, a third-1 connector and a third-2 connector disposed between the second LED stack and the third LED stack, and a plurality of pads disposed over the first LED stack, and electrically connected to the first, second, and third LED stacks. Each of the first, second, and third LED stacks has a light generation region and a peripheral region disposed around the light generation region.

公开(公告)号：US20230369301A1

公开(公告)日：2023-11-16

申请号：US18226779

申请日：2023-07-27

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU ,  Jong Hyeon CHAE

IPC: H01L25/075 ,  H01L33/42 ,  H01L33/62

CPC classification number: H01L25/0756 ,  H01L33/42 ,  H01L25/0753 ,  H01L33/62

Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material.

公开(公告)号：US20220037570A1

公开(公告)日：2022-02-03

申请号：US17381744

申请日：2021-07-21

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15

Abstract: A stacked light emitting device includes a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, a third-1 connector and a third-2 connector disposed between the second LED stack and the third LED stack, and a plurality of pads disposed over the first LED stack, and electrically connected to the first, second, and third LED stacks. Each of the first, second, and third LED stacks has a light generation region and a peripheral region disposed around the light generation region.

公开(公告)号：US20210351229A1

公开(公告)日：2021-11-11

申请号：US17314562

申请日：2021-05-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/38 ,  H01L25/075

Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.