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1.发明申请公开(公告)号：US20200283575A1
公开(公告)日：2020-09-10
申请号：US16066272
申请日：2016-09-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chane YUAN , Hongyun LUO , Wei LIN , Huayong FAN
Abstract: A silicone-modified polyphenylene ether resin containing an unsaturated double bond, and a thermosetting resin composition, a prepreg, and a laminate containing the resin. By introducing a C═C double bond and a siloxy group into an end group of polyphenylene ether, the resin combines the low dielectric property of double bond curing and the advantages such as desirable heat resistance, weatherability, flame retardancy, dielectric property, and low water absorbency of the siloxy group. The resin can provide a high-frequency, high-speed copper-clad laminate with excellent dielectric property, humidity resistance, and heat resistance that are required by the high-frequency, high-speed copper-clad laminate.
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2.发明申请公开(公告)号：US20200002473A1
公开(公告)日：2020-01-02
申请号：US16465193
申请日：2017-03-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chane YUAN , Hongyun LUO , Huayong FAN , Wei LIN
Abstract: A styryl siloxy polyphenylene ether resin, a preparation method therefor and an application thereof. The styryl siloxy polyphenylene ether resin is obtained by introducing styryl groups and siloxy groups into polyphenylene end groups by means of a simple synthesis method. The resin combines low dielectric property of curing of styryl groups and heat resistance, weather resistance, flame retardancy, dielectric property, and low water absorption of siloxy groups, thereby making better use of the application advantages of polyphenylene ether resins in copper clad laminates and providing excellent dielectric property, moist-heat resistance and heat resistance required by a high-frequency and high-speed copper clad laminate.
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3.发明申请公开(公告)号：US20230063436A1
公开(公告)日：2023-03-02
申请号：US17788966
申请日：2020-03-31
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Zengbiao HUANG , Huayong FAN , Yongjing XU , Jianlong HUANG , Naidong SHE
Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
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4.发明申请公开(公告)号：US20230045848A1
公开(公告)日：2023-02-16
申请号：US17789005
申请日：2020-03-31
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Huayong FAN , Zengbiao HUANG , Yongjing XU
Abstract: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.
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