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公开(公告)号：US20240287282A1
公开(公告)日：2024-08-29
申请号：US18575212
申请日：2022-07-27
发明人： Naidong SHE , Qianfa LIU , Zengbiao HUANG , Yongjing XU , Songgang CHAI , Yanhua ZHANG
CPC分类号： C08K3/36 , C08J5/244 , C08J5/249 , C09D7/61 , C09D7/68 , C09D7/69 , C09J7/30 , C09J11/04 , C08J2363/00 , C08K2201/005 , C09J2400/166 , C09J2463/00 , H05K1/0366
摘要： The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.
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公开(公告)号：US20240218217A1
公开(公告)日：2024-07-04
申请号：US18525254
申请日：2023-11-30
发明人： Jinchao DONG , Naidong SHE , Yanhua ZHANG , Junqi TANG
IPC分类号： C09J163/00 , C08K3/36 , C08K7/18 , C08L63/00 , C09J7/30
CPC分类号： C09J163/00 , C08K3/36 , C08K7/18 , C08L63/00 , C09J7/30 , C08K2201/005 , C08L2203/30 , C09J2400/10 , C09J2463/00 , C09J2467/005 , C09J2479/08
摘要： Thermosetting resin composition and insulating adhesive film. The thermosetting resin composition comprises 30-70 parts of epoxy resin, 5-500 parts of a modified spherical silica powder, and 30-70 parts of a curing agent; the modified spherical silica powder comprises an amino-modified spherical silica powder with a D50 particle size of 0.1-2.0 μm and a coefficient of variation of ≥35% in particle size distribution. By using modified spherical silica powder in epoxy resin system and controlling its D50 particle size and coefficient of variation in particle size distribution, the resin composition can reduce melt viscosity of high-filling system and achieve a low melt viscosity in an insulating adhesive film conducive to the filling of fine circuits. The resin composition for preparation of a build-up adhesive FC-BGA film of a high-filling system has strong bite-etching resistance, low surface roughness after Desmear treatment, high adhesive force with electroless copper and low dielectric loss.
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3.发明申请公开(公告)号：US20230063436A1
公开(公告)日：2023-03-02
申请号：US17788966
申请日：2020-03-31
发明人： Zengbiao HUANG , Huayong FAN , Yongjing XU , Jianlong HUANG , Naidong SHE
摘要： Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
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4.发明申请公开(公告)号：US20200332109A1
公开(公告)日：2020-10-22
申请号：US16849041
申请日：2020-04-15
发明人： Naidong SHE , Zengbiao HUANG
摘要： The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
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