公开(公告)号：US20170287743A1

公开(公告)日：2017-10-05

申请号：US15474107

申请日：2017-03-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Nobuo KOBAYASHI ,  Konosuke SASAHIRA ,  Katsuhiro YAMAZAKI

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  H01L21/687 ,  B08B3/04 ,  B08B3/08

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/6719

Abstract: According to the embodiment, a substrate treating device 1 that rotates and washes a substrate, the device includes a spinning holding mechanism for holding a substrate, a treatment liquid supply nozzle for supplying a treatment liquid to the substrate, a shielding plate that is arranged opposite to the substrate held by the spinning holding mechanism and that moves in a contact/separate direction with respect to the substrate, a shielding plate rotating mechanism for rotating the shielding plate, and a control device for controlling the shielding plate rotating mechanism to rotate the shielding plate without moving the shielding plate from a standby position when the treatment liquid is supplied from the treatment liquid supply nozzle. It is possible to prevent contamination of a substrate during the treatment process.

公开(公告)号：US20170287744A1

公开(公告)日：2017-10-05

申请号：US15468577

申请日：2017-03-24

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Nobuo KOBAYASHI ,  Takeki KOGAWA ,  Katsuhiro YAMAZAKI ,  Yuki SAITO

IPC: H01L21/67 ,  G02F1/1333 ,  H01L21/306

Abstract: According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.

公开(公告)号：US20240091828A1

公开(公告)日：2024-03-21

申请号：US18369002

申请日：2023-09-15

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Junji ISHIHARA ,  Katsuhiro YAMAZAKI ,  Hisaaki MIYASAKO ,  Yukinobu NISHIBE

IPC: B08B9/08 ,  B08B9/20 ,  B08B9/46

CPC classification number: B08B9/0813 ,  B08B9/20 ,  B08B9/46 ,  B08B2209/08

Abstract: According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.

公开(公告)号：US20210098279A1

公开(公告)日：2021-04-01

申请号：US17034173

申请日：2020-09-28

Applicant: SHIN-ETSU ENGINEERING CO., LTD. ,  SHIBAURA MECHATRONICS CORPORATION

Inventor： Shunya KUBOTA ,  Emi MATSUI ,  Katsuhiro YAMAZAKI ,  Yoshikazu OHTANI ,  Kyouhei TOMIOKA

IPC: H01L21/683 ,  H01L21/67

Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a table 20 configured to support a processing target W including a substrate W1, a ring W2 surrounding a surrounding of the substrate W1, and a dicing tape W3 adhered to a lower surface of the substrate W1 and a lower surface of the ring W2, and a liquid supplier 50 configured to eject a liquid which does not mix with a processing liquid for processing the substrate W1 and which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, an outer circumference end portion of the substrate W1 of the processing target W supported by the table 20 rotating by the rotation mechanism 30, and between the substrate W1 and the ring W2 of the processing target W supported by the table 20 rotating by the rotation mechanism in accordance with a rotation number of the table 20 to supply the liquid between the substrate W1 and the ring W2 of the processing target W.