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公开(公告)号：US20170304992A1
公开(公告)日：2017-10-26
申请号：US15512957
申请日：2015-09-25
发明人： Michito SATO , Junichi UENO , Kaoru ISHII , Hiromi KISHIDA , Yuya NAKANISHI , Ryosuke YODA , Yosuke KANAI
IPC分类号： B24B37/34 , B24B37/04 , B24B53/017 , H01L21/304
摘要： A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.
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公开(公告)号：US20170144266A1
公开(公告)日：2017-05-25
申请号：US15310053
申请日：2015-05-14
发明人： Michito SATO , Junichi UENO , Kaoru ISHII , Yoshihide KAWAMURA , Hiroshi YOSHIDA , Masataka TAKAGI
IPC分类号： B24B37/22 , B24B37/26 , H01L21/306 , B24B37/24
CPC分类号： B24B37/22 , B24B37/24 , B24B37/26 , H01L21/30625
摘要： Provided is a polishing pad capable of sufficiently reducing minute defects to be generated after polishing on a workpiece which are detected in measurement for a particle size of 26 nm or smaller and capable of providing the workpiece with excellent surface flatness. The polishing pad includes a polishing layer having a polishing surface to polish a workpiece, and includes, in the side opposite to the polishing surface of the polishing layer, an intermediate layer having an amount of deformation C larger than that of the polishing layer, a hard layer having an amount of deformation C smaller than that of the polishing layer, and a cushion layer having an amount of deformation C larger than that of the intermediate layer, in which each of the amounts of deformations C is defined as an amount of deformation in the case of compression in a thickness direction, and the intermediate layer, the hard layer, and the cushion layer are laminated in this order from the side of the polishing layer.
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公开(公告)号：US20170304991A1
公开(公告)日：2017-10-26
申请号：US15513477
申请日：2015-10-02
发明人： Michito SATO , Yosuke KANAI
IPC分类号： B24B37/34 , F16M11/42 , F16M11/10 , H01L21/304 , B24B37/04
摘要： A turn table transport carriage configured to carry a turn table removed from a polishing apparatus or turn table which is to be disposed to the polishing apparatus, turn table transport carriage including a turn table holding section configured to hold the turn table, support base which supports the turn table holding section from a lower side, elevating mechanism which moves up and down the turn table holding section, and inclination mechanism which inclines the turn table holding section holding the turn table, the turn table transport carriage being characterized by enabling carrying the turn table in a state where the turn table holding section holding the turn table is inclined by the inclination mechanism. Consequently, there is provided the turn table transport carriage which has a narrow width at the time of carrying the turn table and can reduce a width of a passage for carrying the turntable.
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公开(公告)号：US20160008947A1
公开(公告)日：2016-01-14
申请号：US14771967
申请日：2014-02-26
发明人： Michito SATO
摘要： The invention is directed to a template assembly configured to hold a workpiece in polishing of the workpiece, including: a PET base; an annular template adhering to an outer circumferential portion of a lower surface of the PET base, the template having an annular notch formed at an upper portion of an inner surface of the template; and a discoid backing pad whose peripheral portion is fitted into the notch, the backing pad adhering to a central portion of the lower surface of the PET base, wherein a recess configured to receive and hold the workpiece during polishing is defined by the inner surface of the template and a lower surface of the backing pad. This template assembly can reduce in-plane variation in depth of the recess and thereby improve flatness of a polished workpiece while inhibiting the occurrence of a scratch and a defect of the workpiece.
摘要翻译： 本发明涉及一种模板组件，其被配置为将工件保持在工件的抛光中，包括：PET基座; 所述模板在所述PET基材的内表面的上部形成有环状的切口，所述环状模板粘附在所述PET基材的下表面的外周部， 以及圆盘状背衬垫，其周边部分装配到所述凹口中，所述背衬粘附在所述PET基底的下表面的中心部分，其中构造成在抛光期间接纳和保持所述工件的凹部由 模板和背衬的下表面。 该模板组件可以减少凹部的平面内的变化，从而提高抛光工件的平整度，同时抑制工件的划痕和缺陷的发生。
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公开(公告)号：US20230137813A1
公开(公告)日：2023-05-04
申请号：US17917781
申请日：2021-02-08
发明人： Masaaki OSEKI , Tatsuo ABE , Michito SATO
IPC分类号： B24B37/04 , B24B37/005 , H01L21/306
摘要： A method for polishing a wafer in order to correct a shape of a polished wafer subjected to polishing, by pressing the wafer to a polishing pad while continuously supplying a composition for polishing containing water to perform correction-polishing, the method including the steps of: measuring the shape of the polished wafer before performing the correction-polishing; determining, in accordance with the measured shape of the polished wafer, a kind and concentration of a surfactant to be contained in the composition for polishing; and performing the correction-polishing while supplying the composition for polishing adjusted on a basis of the determined kind and concentration of the surfactant. This provides a method and apparatus for polishing a wafer that make it possible to reduce, in the latter polishing step, a variation in the shape of the wafer that occurred in a preceding polishing step.
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公开(公告)号：US20180369984A1
公开(公告)日：2018-12-27
申请号：US15777745
申请日：2016-11-29
发明人： Masaaki OSEKI , Michito SATO , Kaoru ISHII
IPC分类号： B24B37/015 , H01L21/306 , H01L21/66
摘要： A polishing method including polishing to polish a surface of a wafer by sliding the wafer held by a polishing head on a surface of a polishing pad while supplying a polishing slurry to the polishing pad attached to a turntable, the method including correlation derivation to obtain a correlation between a surface temperature of the polishing pad and a haze level of a wafer polished with the use of the polishing pad in advance before performing the polishing, and also the wafer is polished in the polishing while controlling the surface temperature of the polishing pad based on the correlation between the surface temperature of the polishing pad and the haze level of the wafer polished with the use of the polishing pad. Consequently, the polishing method can control a haze in polishing a wafer and thereby prolong the service life of the polishing pad.
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公开(公告)号：US20180229344A1
公开(公告)日：2018-08-16
申请号：US15751990
申请日：2016-08-16
发明人： Junichi UENO , Michito SATO , Kaoru ISHII
IPC分类号： B24B37/015 , H01L21/304 , B24B49/14 , H01L21/02 , H01L21/67
摘要： A polishing method including rubbing a wafer held by holding means against a polishing pad attached to a turntable while cooling the turntable by supplying a refrigerant to a refrigerant flow path provided in the turntable which is driven to rotate by a motor, thereby performing polishing, the polishing method being characterized in that, during standby after end of the polishing of the wafer and before performing the polishing of a next wafer, a flow volume of the refrigerant is controlled to be less than a flow volume of the refrigerant during the polishing where the wafer is polished, the turntable is rotated by the motor, and a water retaining liquid having a temperature adjusted to a room temperature or more is supplied to the polishing pad.
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公开(公告)号：US20180043500A1
公开(公告)日：2018-02-15
申请号：US15557499
申请日：2016-03-03
发明人： Masaaki OSEKI , Michito SATO
CPC分类号： B24B37/26 , B24B37/04 , B24B37/24 , B24B37/30 , B24B41/06 , B24D18/0027 , B24D18/0045
摘要： A method for manufacturing a polishing head, includes: forming, on a lower end surface of an intermediate plate, a groove which extends from an inlet of an incompressible fluid to an outer peripheral portion of the intermediate plate and a groove which extends from an outlet of air to the outer peripheral portion of the intermediate plate, also including, after attaching an elastic film to a lower end surface of a rigid ring and coupling an upper end surface of the rigid ring with the lower end surface of the intermediate plate to form a space section: depressurizing the inside of the space section; and discharging the air in the space section from the outlet while pouring the incompressible fluid into the space section from the inlet after the depressurizing, and closing the inlet and outlet to seal the incompressible fluid in the space section.
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公开(公告)号：US20170304986A1
公开(公告)日：2017-10-26
申请号：US15512939
申请日：2015-09-24
发明人： Junichi UENO , Michito SATO , Kaoru ISHII , Hiromi KISHIDA , Yosuke KANAI , Yuya NAKANISHI
IPC分类号： B24B37/005 , H01L21/304 , B24B37/10
CPC分类号： B24B37/0053 , B24B37/10 , B24B37/34 , B24B49/12 , H01L21/304
摘要： A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.
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公开(公告)号：US20180264620A1
公开(公告)日：2018-09-20
申请号：US15761042
申请日：2016-09-20
发明人： Michito SATO
CPC分类号： B24B37/30 , G01B5/061 , G01B11/0608 , G01B21/18
摘要： A method for measuring a template includes: preparing a measurement wafer and measuring a thickness of the measurement wafer; mounting the template on a reference plane; housing the measurement wafer in the concave portion of the template; measuring heights of the annular member and the measurement wafer from the reference plane in a state where a load is applied to the annular member of the template and the measurement wafer by using a pressing jig; and calculating a depth of the concave portion of the template in the state where the load is applied by using the pressing jig from the measured thickness of the measurement wafer and the heights of the annular member and the measurement wafer. Consequently, it is possible to measure the depth of the concave portion of the template in a state closer to a state during polishing than that realized by a conventional measuring method.
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