公开(公告)号：US20170179022A1

公开(公告)日：2017-06-22

申请号：US15367264

申请日：2016-12-02

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Shunichiro MATSUMOTO ,  Hitoshi KONDO ,  Katsuya FUKASE

IPC: H01L23/528 ,  H01L21/56 ,  H01L23/00 ,  H01L23/532

CPC classification number: H01L23/528 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10175 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81022 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83005 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A wiring board includes a single-layer insulating layer, and a single-layer interconnect layer embedded in the insulating layer, wherein an entirety of a first surface of the interconnect layer is exposed in a recessed position relative to a first surface of the insulating layer, and a second surface of the interconnect layer is partially exposed in a recessed position relative to a second surface of the insulating layer.

公开(公告)号：US20160316560A1

公开(公告)日：2016-10-27

申请号：US15097473

申请日：2016-04-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Toyoaki SAKAI ,  Tomoyuki SHIMODAIRA ,  Shunichiro MATSUMOTO ,  Kentaro KANEKO

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K3/007 ,  H05K1/144 ,  H05K3/3436 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/0191

Abstract: A wiring board includes an insulating layer; and a wiring layer embedded in the insulating layer at one surface side of the insulating layer, one surface of the wiring layer being exposed from one surface of the insulating layer, the wiring layer including a first portion and a second portion whose width is wider than that of the first portion, one surface of the first portion and one surface of the second portion being flush with each other, and the first portion being thinner than the second portion.

Abstract translation: 布线板包括绝缘层; 以及在所述绝缘层的一个表面侧埋设在所述绝缘层中的布线层，所述布线层的一个表面从所述绝缘层的一个表面露出，所述布线层包括第一部分和宽度大于 第一部分的第一部分的一个表面和第二部分的一个表面彼此齐平，并且第一部分比第二部分薄。