-
公开(公告)号：US10261110B2
公开(公告)日：2019-04-16
申请号：US15356868
申请日：2016-11-21
摘要： A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.
-
公开(公告)号：US20170205445A1
公开(公告)日：2017-07-20
申请号：US15407427
申请日：2017-01-17
IPC分类号： G01R1/073
CPC分类号： G01R1/07371
摘要： A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate, a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate, and second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, A notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate.
-
公开(公告)号：US20170146569A1
公开(公告)日：2017-05-25
申请号：US15356868
申请日：2016-11-21
CPC分类号： G01R1/07371 , G01R31/2601
摘要： A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.
-
公开(公告)号：US10386387B2
公开(公告)日：2019-08-20
申请号：US15404832
申请日：2017-01-12
发明人： Kosuke Fujihara , Yuichiro Shimizu
摘要： A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.
-
公开(公告)号：US10139430B2
公开(公告)日：2018-11-27
申请号：US15420111
申请日：2017-01-31
发明人： Chikaomi Mori , Yuichiro Shimizu , Kosuke Fujihara
摘要： OBJECTTo improve the strength of a probe guide and improve the abrasion resistance of the probe guide.MEANS FOR SETTLEMENTA guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.
-
公开(公告)号：US20170242057A1
公开(公告)日：2017-08-24
申请号：US15420111
申请日：2017-01-31
发明人： Chikaomi Mori , Yuichiro Shimizu , Kosuke Fujihara
CPC分类号： G01R1/07371 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： OBJECTTo improve the strength of a probe guide and improve the abrasion resistance of the probe guide.MEANS FOR SETTLEMENTA guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.
-
公开(公告)号：US10309988B2
公开(公告)日：2019-06-04
申请号：US15407427
申请日：2017-01-17
IPC分类号： G01R1/073
摘要： A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate, a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate, and second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, A notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate.
-
公开(公告)号：US20170205444A1
公开(公告)日：2017-07-20
申请号：US15404832
申请日：2017-01-12
发明人： Kosuke Fujihara , Yuichiro Shimizu
CPC分类号： G01R1/07371 , G01R3/00
摘要： A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes formed at positions corresponding to the first through-holes, and a silicon oxide layer formed on exposed surfaces of the first silicon substrate and the second silicon substrate.
-
公开(公告)号：US20230072659A1
公开(公告)日：2023-03-09
申请号：US17903474
申请日：2022-09-06
发明人： Michio Horiuchi , Yuichiro Shimizu
摘要： A ceramic composition is provided. The ceramic composition includes a corundum phase, and a CeAl11O18 phase. A ratio of an amount of substance of the CeAl11O18 phase with respect to a total amount of substance of the ceramic composition is not lower than 0.5 mol % and not higher than 5 mol %.
-
公开(公告)号：US20210391518A1
公开(公告)日：2021-12-16
申请号：US17342841
申请日：2021-06-09
发明人： Michio Horiuchi , Yuichiro Shimizu , Masaya Tsuno
摘要： A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.043 秒)