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公开(公告)号:US11731398B2
公开(公告)日:2023-08-22
申请号:US16312765
申请日:2017-04-28
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Wei He , Terutoshi Kumaki , Makoto Karatsu , Takashi Nagaoka
IPC: B32B15/08 , B32B7/12 , H01G11/18 , H01G11/78 , H01M10/0525 , H01M50/124 , H01M50/129 , H01M50/119 , H01M50/121 , H01M50/103 , H01M50/145 , H01M50/133
CPC classification number: B32B15/08 , B32B7/12 , H01G11/18 , H01G11/78 , H01M10/0525 , H01M50/119 , H01M50/121 , H01M50/124 , H01M50/129 , B32B2457/10 , B32B2457/16 , H01M50/103 , H01M50/133 , H01M50/145
Abstract: Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity.
[Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layer 2 serving as an outer layer, a heat fusible resin layer 3 serving as an inner layer, and a metal foil layer 4 disposed between both the two layers. The heat resistant resin layer 2 is composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5 composed of a cured film of an electron beam curable resin composition.-
公开(公告)号:US11444350B2
公开(公告)日:2022-09-13
申请号:US16233181
申请日:2018-12-27
Applicant: SHOWA DENKO PACKAGING CO., LTD.
Inventor: Wei He
IPC: H01M50/103 , H01M50/116 , H01M50/124 , H01M10/0525 , H01M50/183 , H01G11/80 , H01M50/131
Abstract: A packaging material for a power storage device includes a base material layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between both the layers. The base material layer and the metal foil layer are adhered via an outer adhesive layer. The outer adhesive layer is formed of a cured film of a two-part curing type urethane adhesive agent including a main agent containing a polyol and a multifunctional isocyanate mixture, wherein a content rate of the polyol is 50 mass % to 95 mass %. The multifunctional isocyanate mixture is composed of a mixture containing an aromatic multifunctional isocyanate and an aliphatic multifunctional isocyanate having an aromatic ring.
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