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公开(公告)号:US20240327687A1
公开(公告)日:2024-10-03
申请号:US18293847
申请日:2022-09-06
Applicant: SIKA TECHNOLOGY AG
Inventor: Geng LIN , Blanka PROKO
IPC: C09J163/00 , C09J5/06 , C09J11/08
CPC classification number: C09J163/00 , C09J5/06 , C09J11/08 , C09J2463/00
Abstract: A one-component thermosetting epoxy resin adhesive, including heat-expandable microspheres with an expansion-initiation temperature (Ts) between 90° C.-115° C. and a mean particle size D (0.5) between 30-75 μm, at least at least one toughness improver and a viscosity of 500 to 5000 Pas at 25° C. The room temperature pumpable expandable adhesives have good adhesion on metal substrates, sufficient expansion rates and a closed surface of the cured foamed material.
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公开(公告)号:US20220064505A1
公开(公告)日:2022-03-03
申请号:US17007604
申请日:2020-08-31
Applicant: SIKA TECHNOLOGY AG
Inventor: Geng LIN , Blanka PROKO
Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) wherein substituents R′ and R″ independently of one another are H or CH3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula where R2= methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.
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公开(公告)号:US20180037708A1
公开(公告)日:2018-02-08
申请号:US15671977
申请日:2017-08-08
Applicant: SIKA TECHNOLOGY AG
Inventor: Geng LIN , Blanka PROKO , Steve DAVIS
CPC classification number: C08J9/107 , B29C44/18 , B29C44/3415 , B29C44/42 , B29K2027/06 , B29K2063/00 , B29L2031/30 , B60R13/0815 , C08J9/0061 , C08J9/103 , C08J9/105 , C08J9/228 , C08J2201/022 , C08J2201/026 , C08J2201/038 , C08J2203/04 , C08J2309/06 , C08J2363/02 , C08J2409/06 , C08J2427/06 , C08J2433/06 , C08J2463/02 , C08K3/26 , C08K2003/265 , C08L63/00 , C08L27/06 , C08L33/06
Abstract: Pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder. The pumpable filler materials provide the advantage that they can be applied as needed using conventional injection equipment and can be expanded to provide foam with good physical strength, high expansion and excellent adhesion on oiled metal substrates. Methods for filling closed spaces with the pumpable thermally foaming filler composition as well as vehicle parts are obtainable with the indicated methods.
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