公开(公告)号：US20160207758A1

公开(公告)日：2016-07-21

申请号：US14914015

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： Edvard KALVESTEN ,  Thorbjorn EBEFORS ,  Niklas SVEDIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

Abstract translation: 一种装置包括具有附接到其上的微型部件（702）的基底（700）。 适当地，它设置有用于向组件（702）进行信号的路由选择元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 优选地通过共晶接合，通过间隔件（706），设置在基底基板（700）上方的玻璃材料的封盖结构（708），其中封盖结构（708）包括通孔（710），包括金属 用于提供通过封盖结构的电连接。 通孔可以通过冲压/压制方法制成，在加热下需要加压针，使玻璃软化并施加压力至玻璃中预定的深度。 然而，其他方法是可行的，例如钻孔，蚀刻，爆破。