公开(公告)号：US09956720B2

公开(公告)日：2018-05-01

申请号：US14431348

申请日：2013-09-27

Applicant: North Carolina State University

Inventor： Thomas A. Dow ,  Erik Zdanowicz ,  Alexander Sohn ,  Ron Scattergood ,  William John Nowak, Jr.

IPC: B29C59/02 ,  B29C33/42 ,  B29C33/38 ,  B81C99/00 ,  H01L31/0232 ,  B82Y40/00 ,  B29L31/00 ,  B29L11/00

CPC classification number: B29C59/022 ,  B29C33/3878 ,  B29C33/424 ,  B29C2059/023 ,  B29K2995/0018 ,  B29K2995/0093 ,  B29L2011/00 ,  B29L2031/7562 ,  B81C99/0025 ,  B81C2201/0153 ,  B82Y40/00 ,  H01L31/02325

Abstract: The subject matter described herein relates to methods and systems for fast imprinting of nanometer scale features in a workpiece. According to one aspect, a system for producing nanometer scale features in a workpiece is disclosed. The system includes a die having a surface with at least one nanometer scale feature located thereon. A first actuator moves the die with respect to the workpiece such that the at least one nanometer scale feature impacts the workpiece and imprints a corresponding at least one nanometer scale feature in the workpiece.

公开(公告)号：US20160272737A1

公开(公告)日：2016-09-22

申请号：US15035897

申请日：2014-12-17

Applicant: DIC CORPORATION

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: C08F12/36 ,  H01L21/311 ,  B29C59/02

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract translation: 提供一种干蚀刻抗蚀剂用固化性树脂组合物，该固化性树脂组合物含有在侧链具有包含具有乙烯基的芳香族基团的特定结构的聚合物（A）。 聚合物（A）包括80至100重量％的特定结构。 此外，提供了通过固化用于干蚀刻抗蚀剂的可固化组合物获得的干蚀刻抗蚀剂掩模，以及具有通过纳米压印法形成的图案的干蚀刻抗蚀剂掩模。

公开(公告)号：US08916053B2

公开(公告)日：2014-12-23

申请号：US13528348

申请日：2012-06-20

Applicant: Yoshiaki Kawamonzen ,  Yasuaki Ootera ,  Akiko Yuzawa ,  Naoko Kihara ,  Yoshiyuki Kamata ,  Hiroyuki Hieda ,  Norikatsu Sasao ,  Ryosuke Yamamoto ,  Takeshi Okino ,  Tomoyuki Maeda ,  Takuya Shimada

Inventor： Yoshiaki Kawamonzen ,  Yasuaki Ootera ,  Akiko Yuzawa ,  Naoko Kihara ,  Yoshiyuki Kamata ,  Hiroyuki Hieda ,  Norikatsu Sasao ,  Ryosuke Yamamoto ,  Takeshi Okino ,  Tomoyuki Maeda ,  Takuya Shimada

IPC: C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  B44C3/08 ,  B44C5/04 ,  B81C1/00 ,  B44C1/22 ,  H01L21/033 ,  G03F7/00 ,  B41M5/00

CPC classification number: B44C1/227 ,  B41M5/00 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0337 ,  Y10T156/1041

Abstract: A pattern forming method according to an embodiment includes: forming a pattern film on a first substrate, the pattern film having a concave-convex pattern, the pattern film being made of a material containing a first to-be-imprinted agent; forming a material film on a second substrate, the material film containing a second to-be-imprinted agent having a higher etching rate than an etching rate of the first to-be-imprinted agent; transferring the concave-convex pattern of the pattern film onto the material film by applying pressure between the first substrate and the second substrate, with the pattern film being positioned to face the material film, and by curing the second to-be-imprinted agent; detaching the first substrate from the pattern film; and removing the material film by etching, to leave the pattern film on the second substrate.

Abstract translation: 根据实施例的图案形成方法包括：在第一基板上形成图案膜，所述图案膜具有凹凸图案，所述图案膜由包含第一待打印剂的材料制成; 在第二基板上形成材料膜，所述材料膜含有蚀刻速率高于第一待打印剂的蚀刻速率的第二待定印剂; 通过在第一基板和第二基板之间施加压力将图案膜的凹凸图案转印到材料膜上，图案膜定位成面对材料膜，并且通过固化第二待打印剂; 从图案膜分离第一衬底; 并通过蚀刻去除材料膜，以将图案膜留在第二基板上。

公开(公告)号：US20110117723A1

公开(公告)日：2011-05-19

申请号：US13014771

申请日：2011-01-27

Applicant: Robert Seidel ,  Carsten Peters ,  Frank Feustel

Inventor： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC: H01L21/768 ,  H01L21/762 ,  H01L21/28

CPC classification number: B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

Abstract: By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Abstract translation: 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US20090074955A1

公开(公告)日：2009-03-19

申请号：US12212330

申请日：2008-09-17

Applicant: Harry D. Rowland

Inventor： Harry D. Rowland

IPC: B32B3/10 ,  B05D5/00

CPC classification number: G03F7/0002 ,  B81C1/00031 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00

Abstract: A method for patterning a surface includes providing a first layer of mechanically deformable material having a first surface. A second layer of mechanically deformable material is placed on the first surface. At least a portion of the second layer is controllably displaced to form at least one patterned void through the second layer.

Abstract translation: 用于图案化表面的方法包括提供具有第一表面的可机械可变形材料的第一层。 第二层机械可变形材料放置在第一表面上。 可控地移位第二层的至少一部分以通过第二层形成至少一个图案化的空隙。

公开(公告)号：US20070117243A1

公开(公告)日：2007-05-24

申请号：US11286065

申请日：2005-11-22

Applicant: Manish Sharma

Inventor： Manish Sharma

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: B81C1/00063 ,  B81B2201/06 ,  B81C2201/0133 ,  B81C2201/0153

Abstract: The present invention provides a method of fabricating a biosensor. The method includes providing a substrate which has a surface coating. The surface coating is deformable and the substrate includes a layered structure which has at least two electrically conductive layers separated by at least one electrically insulating layer. The method also includes imprinting a structure into the surface coating. Further, the method includes etching at least a region of the imprinted structure and the substrate to remove at least a portion of the structure and the substrate. The structure is shaped so that the etching forms at least a portion of the biosensor in the substrate and exposes at least a portion of each electrically conductive layer to form electrodes of the biosensor.

Abstract translation: 本发明提供一种制造生物传感器的方法。 该方法包括提供具有表面涂层的基底。 表面涂层是可变形的，并且衬底包括具有由至少一个电绝缘层分开的至少两个导电层的分层结构。 该方法还包括将结构压印到表面涂层中。 此外，所述方法包括蚀刻所述压印结构的至少一个区域和所述基板以去除所述结构和所述基板的至少一部分。 该结构被成形为使得蚀刻形成衬底中的生物传感器的至少一部分并且暴露出每个导电层的至少一部分以形成生物传感器的电极。

公开(公告)号：US07169251B2

公开(公告)日：2007-01-30

申请号：US10436657

申请日：2003-05-13

Applicant: Lingjie J Guo ,  Xing Cheng

Inventor： Lingjie J Guo ,  Xing Cheng

IPC: B82B3/00 ,  B82B1/00 ,  B37B37/02

CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2300/0681 ,  B01L2300/0896 ,  B01L2400/0418 ,  B01L2400/0421 ,  B01L2400/086 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0153 ,  B82Y30/00 ,  G01N2021/058 ,  Y10S977/78 ,  Y10S977/84 ,  Y10S977/882

Abstract: A method of forming nanofluidic enclosed channels includes providing a first substrate having a layer of a first material disposed thereon. A plurality of nanoscale slots is formed along a second substrate using nanolithography, etching, or other disclosed techniques. The first substrate is then bonded to the second substrate such that the layer of the first material on the first substrate is adjacent the plurality of slots on the second substrate to define a plurality of enclosed nanofluidic channels therethrough.

Abstract translation: 形成纳流体封闭通道的方法包括提供具有设置在其上的第一材料层的第一基底。 使用纳米光刻，蚀刻或其它公开的技术沿着第二基板形成多个纳米级槽。 然后将第一衬底接合到第二衬底，使得第一衬底上的第一材料层与第二衬底上的多个槽相邻以限定穿过其中的多个封闭的纳米流体通道。

公开(公告)号：US20060063368A1

公开(公告)日：2006-03-23

申请号：US10943559

申请日：2004-09-17

Applicant: Shashank Sharma

Inventor： Shashank Sharma

IPC: H01L21/4763

CPC classification number: G03F7/0002 ,  B81C99/009 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  Y10T428/31612

Abstract: Nano-scale devices and methods provide reduced feature dimensions of features on the devices. A surface of a device substrate having a pattern of spaced apart first nanowires is consumed, such that a dimension of the first nanowires is reduced. A second nanowire is formed in a trench or gap between adjacent ones of the first nanowires, such that the nano-scale device includes a set of features that includes the first nanowires with the reduced dimension and the second nanowire spaced from the adjacent first nanowires by sub-trenches.

Abstract translation: 纳米级设备和方法可以减少设备上特征的特征尺寸。 具有间隔开的第一纳米线的图案的器件衬底的表面被消耗，使得第一纳米线的尺寸减小。 第二纳米线形成在相邻的第一纳米线之间的沟槽或间隙中，使得纳米级器件包括一组特征，其包括具有减小的尺寸的第一纳米线，并且第二纳米线与相邻的第一纳米线间隔开，第二纳米线通过 小壕沟

公开(公告)号：US20180085752A1

公开(公告)日：2018-03-29

申请号：US15700731

申请日：2017-09-11

Applicant: Illumina, Inc.

Inventor： Hui Han ,  Dajun A. Yuan ,  M. Shane Bowen

IPC: B01L3/00 ,  B29C65/16 ,  B29C65/14 ,  H01J37/32 ,  B32B17/06

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0877 ,  B01L2300/0887 ,  B01L2300/0896 ,  B29C65/1406 ,  B29C65/1612 ,  B32B17/064 ,  B81C1/0038 ,  B81C2201/0153 ,  G03F7/0002 ,  G03F7/038 ,  G03F7/16 ,  G03F7/2002 ,  G03F7/30 ,  H01J37/32009 ,  H01J2237/3341

Abstract: Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.

公开(公告)号：US20160207758A1

公开(公告)日：2016-07-21

申请号：US14914015

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： Edvard KALVESTEN ,  Thorbjorn EBEFORS ,  Niklas SVEDIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

Abstract translation: 一种装置包括具有附接到其上的微型部件（702）的基底（700）。 适当地，它设置有用于向组件（702）进行信号的路由选择元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 优选地通过共晶接合，通过间隔件（706），设置在基底基板（700）上方的玻璃材料的封盖结构（708），其中封盖结构（708）包括通孔（710），包括金属 用于提供通过封盖结构的电连接。 通孔可以通过冲压/压制方法制成，在加热下需要加压针，使玻璃软化并施加压力至玻璃中预定的深度。 然而，其他方法是可行的，例如钻孔，蚀刻，爆破。