公开(公告)号：US20140099755A1

公开(公告)日：2014-04-10

申请号：US13729918

申请日：2012-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ping Kai Cheng ,  Wen-Shan Tsai

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A fabrication method of a stacked package structure is provided, which includes the steps of: providing a substrate having at least a semiconductor device disposed thereon; and disposing a semiconductor package on the substrate through a plurality of conductive elements such that the semiconductor device is located between the substrate and the semiconductor package, and forming an encapsulant between the substrate and the semiconductor package to encapsulate the semiconductor device. The encapsulant can be formed on the semiconductor package first and then laminated on the substrate to encapsulate the semiconductor device, or alternatively the encapsulant can be filled between the substrate and the semiconductor package driven by a capillary force after the semiconductor package is disposed on the substrate. Therefore, the present invention alleviates pressure and temperature effects on the package to prevent warpage of the substrate and facilitate fabrication of multi-layer stacked package structures.

Abstract translation: 提供了一种堆叠封装结构的制造方法，其包括以下步骤：提供至少设置有半导体器件的衬底; 以及通过多个导电元件将半导体封装设置在所述衬底上，使得所述半导体器件位于所述衬底和所述半导体封装之间，以及在所述衬底和所述半导体封装之间形成密封剂以封装所述半导体器件。 首先可以在半导体封装上形成密封剂，然后层压在衬底上以封装半导体器件，或者可选地，在将半导体封装设置在衬底上之后，密封剂可以填充在由毛细管力驱动的衬底和半导体封装之间 。 因此，本发明减轻了对包装件的压力和温度影响，以防止衬底的翘曲并且有利于多层堆叠包装结构的制造。