公开(公告)号：US09704727B2

公开(公告)日：2017-07-11

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

公开(公告)号：US20150170945A1

公开(公告)日：2015-06-18

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

Abstract translation: EFEM包括壳体3，其构成通过将负载端口4连接到设置在壁31上的开口31a而基本上闭合的晶片运送室9，并且连接处理装置6; 晶片传送装置2，并且在处理装置6和安装在装载端口4上的FOUP 7之间传送晶片; 气体输送口11; 气体吸入口12; 气体反馈路径10; 以及FFU13，其包括设置在气体输送口11中的过滤器13b，并且消除了包含在输送气体中的颗粒，其中晶片输送室9中的气体通过在晶片输送室9中产生向下的气流而循环 并且通过气体反馈路径10反馈气体。