公开(公告)号：US20190145641A1

公开(公告)日：2019-05-16

申请号：US16244490

申请日：2019-01-10

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Yasushi Taniyama ,  Mitsutoshi Ochiai ,  Mitsuo Natsume ,  Atsushi Suzuki

IPC: F24F9/00 ,  H01L21/677 ,  H01L21/67

Abstract: There is provided a method for manufacturing semiconductor. The method includes providing a semiconductor manufacturing apparatus and providing an EFEM. The EFEM includes a shield gas curtain apparatus 6 that forms a gas curtain capable of shielding an opening 23 when an internal space 5S of a purge container 5, in which the humidity is reduced to a predetermined value by means of a bottom purge apparatus 25 provided in a load port 2, is brought into communication with an internal space 3S of a wafer transport chamber 3, the gas curtain being formed of a shield curtain gas blown immediately downward from a location near the opening 23 of the load port 2 and being closer to the wafer transport chamber 3 than the opening 23 at a higher height than an upper edge of the opening 23.

公开(公告)号：US20150024671A1

公开(公告)日：2015-01-22

申请号：US14269360

申请日：2014-05-05

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Yasushi Taniyama ,  Mitsutoshi Ochiai ,  Mitsuo Natsume ,  Atsushi Suzuki

IPC: F24F9/00

CPC classification number: F24F9/00 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67772

Abstract: There is provided an EFEM that includes a shield gas curtain apparatus 6 that forms a gas curtain capable of shielding an opening 23 when an internal space 5S of a purge container 5, in which the humidity is reduced to a predetermined value by means of a bottom purge apparatus 25 provided in a load port 2, is brought into communication with an internal space 3S of a wafer transport chamber 3, the gas curtain being formed of a shield curtain gas blown immediately downward from a location near the opening 23 of the load port 2 and being closer to the wafer transport chamber 3 than the opening 23 at a higher height than an upper edge of the opening 23. The EFEM thus configured can prevent and suppress a rapid increase in the humidity in the purge container, in which the humidity in the interior space is reduced by performing the bottom purging, occurring immediately after a lid of the purge container is opened, so that quality degradation due to the moisture adhered on a wafer can be avoided.

Abstract translation: 提供了一种EFEM，其包括屏蔽气幕装置6，其形成能够屏蔽开口23的气幕，当清洗容器5的内部空间5S通过底部将湿度降低到预定值时 设置在负载端口2中的净化装置25与晶片运送室3的内部空间3S连通，气幕由从负载端口的开口23附近的位置立即向下吹出的屏蔽帘式气体形成 并且比开口23更高的高度比开口23更靠近晶片输送室3.如此构造的EFEM可以防止和抑制净化容器中的湿度的快速增加，其中湿度 通过执行底部清洗，在清洗容器的盖子打开之后立即发生的内部空间被减少，使得由于水分附着在晶片上而导致的质量劣化可以是avoi ded。

公开(公告)号：US09412634B2

公开(公告)日：2016-08-09

申请号：US14537477

申请日：2014-11-10

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Shin Kawahisa ,  Mitsuo Natsume

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67772 ,  H01L21/67389 ,  H01L21/67742

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract translation: 本发明提供一种能够用少量气体代替晶片表面的气氛的气氛置换装置。 该装置被配置为具有能够面对和覆盖要输送的晶片的盖，以及气体供给装置，其将与周围大气不同的性质的气体与盖接触，并且通过 加油站。

公开(公告)号：US20150128441A1

公开(公告)日：2015-05-14

申请号：US14537477

申请日：2014-11-10

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Shin Kawahisa ,  Mitsuo Natsume

IPC: F26B25/00 ,  H01L21/677

CPC classification number: H01L21/67772 ,  H01L21/67389 ,  H01L21/67742

Abstract: The present invention provides an atmosphere replacement apparatus capable of replacing the atmosphere on the surface of a wafer with a small amount of gas. The apparatus is configured to have a cover capable of facing and covering the wafer to be transported, and a gas supply means that supplies gas having properties different from a surrounding atmosphere from the cover, and replaces the atmosphere on the surface of the wafer by the gas.

Abstract translation: 本发明提供一种能够用少量气体代替晶片表面的气氛的气氛置换装置。 该装置被配置为具有能够面对和覆盖要输送的晶片的盖，以及气体供给装置，其将与周围大气不同的性质的气体与盖接触，并且通过 加油站。

公开(公告)号：US09916997B2

公开(公告)日：2018-03-13

申请号：US15072823

申请日：2016-03-17

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Toshimitsu Morihana ,  Yuki Matsumoto ,  Mitsuo Natsume

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67393

Abstract: There is provided an end structure of a nozzle (11) including a gas-flow passage (13) communicable with an opening (104) provided through a bottom of a container (100) configured to contain an object, the nozzle (11) configured so that gas is injected into or discharged from the container (100) through the gas-flow passage (13) and the opening (104). The end structure includes a contact portion (19) provided at an upper end portion of the nozzle (11) and around the gas-flow passage (13), and the contact portion (19) is configured to be brought into contact with a contacted portion (103) provided around the opening (104). The contact portion (19) includes a flat portion (19b) and protruding portions (19a and 19c) each protruding upward relative to the flat portion (19b), and the flat portion (19b) is made of material softer than that of the protruding portions (19a and 19c).

公开(公告)号：US09685359B2

公开(公告)日：2017-06-20

申请号：US14199051

申请日：2014-03-06

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Manabu Funato ,  Mitsuo Natsume ,  Mitsutoshi Ochiai

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67706 ,  H01L21/67265 ,  H01L21/67379 ,  H01L21/67772 ,  H01L21/67775

Abstract: A load port device comprises a link mechanism that has a main moving link whose one end is connected with a door holding member in a rotatable manner, a guide that bends and extends from a horizontal direction to a vertical direction and that guides one end of the main moving link, a main moving block with which the other end of the main moving link is connected in a rotatable manner and a door hoisting shaft that extends in the vertical direction and that moves the main moving block in the extending direction. The link mechanism allows the end of the main moving link to move from the horizontal direction to the vertical direction or from the vertical direction to the horizontal direction along the guide in a state that the other end of the main moving link moves to the vertical direction.

公开(公告)号：US09174253B2

公开(公告)日：2015-11-03

申请号：US13762991

申请日：2013-02-08

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mitsuo Natsume ,  Atsushi Suzuki

IPC: B65B1/04 ,  B08B9/093 ,  H01L21/673 ,  H01L21/677

CPC classification number: B08B9/093 ,  H01L21/67393 ,  H01L21/67775

Abstract: A purge nozzle unit 1 includes a nozzle main body 2 including a trunk 41 and a collar section 8 protruding outward from the trunk 41 and a holder 3 including a side wall 31 that is in slidable contact with an outward face of the collar section 8 and a bottom wall 33 having a through hole 32 with which an outward face of the trunk 41 is in slidable contact and is configured such that a vent 30 in communication with the outside is formed in the holder 3 and the nozzle main body 2 is vertically moved relative to the holder 3 by regulating a pressure in a pressure-regulated space S formed between the nozzle main body 2 and the holder 3 and in communication with the vent 30.

Abstract translation: 吹扫喷嘴单元1包括喷嘴主体2，喷嘴主体2包括行李箱41和从行李箱41向外突出的轴环部分8以及具有与轴环部分8的外表面可滑动接触的侧壁31的支架3，以及 具有贯通孔32的底壁33，其中躯干41的外表面可与滑动接触并且构造成使得在保持器3中形成与外部连通的通气口30，并且喷嘴主体2垂直移动 通过调节形成在喷嘴主体2和保持器3之间并与通气口30连通的压力调节空间S中的压力来相对于保持器3。

公开(公告)号：US09704727B2

公开(公告)日：2017-07-11

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

公开(公告)号：US09239228B2

公开(公告)日：2016-01-19

申请号：US14689551

申请日：2015-04-17

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mitsuo Natsume ,  Masahiro Osawa ,  Toshimitsu Morihana ,  Mitsutoshi Ochiai

IPC: G01N21/64 ,  G01B11/14 ,  G01B11/24 ,  G01B11/00 ,  G01N35/10 ,  G01B11/22

CPC classification number: G01B11/002 ,  G01B11/14 ,  G01B11/22 ,  G01B11/24 ,  G01N21/64 ,  G01N35/1016 ,  G01N2035/1025 ,  H01L21/67265

Abstract: The left-right span between a light projection section 5a and a light receiving section 5b of a mapping sensor 5 having an optical axis L1 extending in a left-right horizontal direction is arranged to be narrower than the span of a front opening of a open cassette 12 which is a smaller one of differently-sized containers conveyed to a load port, and the mapping sensor is attached to a mapping device 4. A first protrusion sensor 6 having an optical axis L2 extending in the left-right horizontal direction is attached to the mapping device 4 to be separated from the mapping sensor 5 in a moving direction of the mapping sensor 5. Furthermore, a second protrusion sensor 7 having an optical axis extending in the up-down moving direction of the mapping sensor 5 is provided.

Abstract translation: 在具有沿左右水平方向延伸的光轴L1的映射传感器5的光投射部分5a和光接收部分5b之间的左右跨度布置成比开口的前开口的跨度窄 盒式录像带12是不同尺寸的容器中较小的一个传送到负载端口的盒式磁带12，并且映射传感器附接到映射装置4.附接有沿左右水平方向延伸的光轴L2的第一突出传感器6 到映射装置4，以在映射传感器5的移动方向上与映射传感器5分离。此外，提供具有在映射传感器5的上下移动方向上延伸的光轴的第二突起传感器7。

公开(公告)号：US20150170945A1

公开(公告)日：2015-06-18

申请号：US14569293

申请日：2014-12-12

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Mikio Segawa ,  Yasushi Taniyama ,  Mitsuo Natsume ,  Atsushi Suzuki ,  Toshihiro Kawai ,  Kunihiko Sato

IPC: H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67017 ,  H01L21/67115 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778

Abstract: An EFEM includes a housing 3 that constitutes a wafer transport chamber 9 that is substantially closed by connecting load ports 4 to an opening 31a provided on a wall 31, and connecting a processing apparatus 6; a wafer transport apparatus 2, and transports a wafer between the processing apparatus 6 and the FOUPs 7 mounted on the load ports 4; a gas delivery port 11; a gas suction port 12; a gas feedback path 10; and a FFU 13 that includes a filter 13b that is provided in the gas delivery port 11, and eliminates particles contained in the delivered gas, wherein the gas in the wafer transport chamber 9 is circulated by generating a downward gasflow in the wafer transport chamber 9 and feeding back the gas through the gas feedback path 10.

Abstract translation: EFEM包括壳体3，其构成通过将负载端口4连接到设置在壁31上的开口31a而基本上闭合的晶片运送室9，并且连接处理装置6; 晶片传送装置2，并且在处理装置6和安装在装载端口4上的FOUP 7之间传送晶片; 气体输送口11; 气体吸入口12; 气体反馈路径10; 以及FFU13，其包括设置在气体输送口11中的过滤器13b，并且消除了包含在输送气体中的颗粒，其中晶片输送室9中的气体通过在晶片输送室9中产生向下的气流而循环 并且通过气体反馈路径10反馈气体。